Bottom PoP Technologies

Applications PoP packages are designed for products requiring efficient memory architectures including multiple buses and increased memory density and performance, while reducing mounted area. Portable electronic products such as mobile phones (baseband or applications processor plus combo memory

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amkor

安靠科技

JST/日压
NA

JST/日压

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BELFUSE
模块

BELFUSE

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TLC
0805

TLC

竟沃电子

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NXP
TO-220

恩XP

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