首页 >PN-1333-DGMB>规格书列表
零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
---|---|---|---|---|
PN-1333-DGMB | 包装:散装 类别:盒子,外壳,机架 箱 描述:BOX ABS GRAY 6.387\ | BUD Bud Industries, Inc. | BUD | |
PN-1333-DGMB | 包装:袋 类别:盒子,外壳,机架 箱 描述:BOX ABS GRAY 6.387\ | BUD Bud Industries, Inc. | BUD | |
LOWCURRENTCONSUMPTIONHIGHRIPPLE-REJECTION | SIISeiko Instruments Inc 精工爱普生精工爱普生株式会社 | SII | ||
5.5VINPUT,300mAVOLTAGEREGULATOR | ABLICABLIC Inc. 艾普凌科艾普凌科有限公司 | ABLIC | ||
Multi-Conductor-DataBus짰ISA/SP-50FOUNDATIONFieldbusorPROFIBUSCable | BELDENBelden Inc. 百通电缆设计科技有限公司 | BELDEN | ||
P-ChannelSiliconMOSFETGeneral-PurposeSwitchingDeviceApplications General-PurposeSwitchingDeviceApplications Features •1.8Vdrive •Halogenfreecompliance •Protectiondiodein | SANYOSanyo 三洋三洋电机株式会社 | SANYO | ||
P-ChannelPowerMOSFET Features •1.8Vdrive •Halogenfreecompliance •Protectiondiodein | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
General-PurposeSwitchingDeviceApplications | SANYOSanyo 三洋三洋电机株式会社 | SANYO | ||
P-ChannelPowerMOSFET Features •1.8Vdrive •Halogenfreecompliance •Protectiondiodein | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
P-ChannelEnhancementModePowerMos.FET | SECOSSeCoS Halbleitertechnologie GmbH 喜可士喜可士股份有限公司 | SECOS | ||
SP13338pF30kVBidirectionalDiscreteTVS Description TheSP1333back-to-backdiodesarefabricatedina proprietarysiliconavalanchetechnology.Thesediodes provideahighESD(electrostaticdischarge)protection levelforelectronicequipment.TheSP1333TVScansafely absorbrepetitiveESDstrikesabovethemaximumcontact disc | Littelfuselittelfuse 力特力特公司 | Littelfuse | ||
P-channelEnhancement-modePowerMOSFET | SSC Silicon Standard Corp. | SSC | ||
6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | STMICROELECTRONICS | ||
MemoryMicromodulesGeneralInformationforD1,D2andCPackaging DESCRIPTION MemoryCardsconsistoftwomainparts:theplasticcard,andtheembeddedMicromodule(which,inturn,carriesthesiliconchip). ■Micromodulesweredevelopedspecificallyfor embeddinginSmartcardsandMemoryCards ■TheMicromoduleprovides: –Supportforthechi | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | STMICROELECTRONICS | ||
TRIANGULARTYPE LEDLAMP(TRIANGULARTYPE) | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | ETC1 | ||
SAWFilter2600MHz | TAI-SAW TAI-SAW TECHNOLOGY CO., LTD. | TAI-SAW | ||
935.1MHz0.125MHzBWSMD3.8x3.8mmSAWIFFilter | TAI-SAW TAI-SAW TECHNOLOGY CO., LTD. | TAI-SAW | ||
PhotoModulesforPCMRemoteControlSystems TheTSOP13..–seriesareminiaturizedreceiversforinfraredremotecontrolsystems.PINdiodeandpreamplifierareassembledonleadframe,theepoxypackageisdesignedasIRfilter. | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
AluminumCapacitors85C,Miniature,AxialLead FEATURES •Lowleakagecurrent •Longshelflife •IdealforapplicationinTVsets,autoradios,radio-phonecombinations,electronictestingequipment •Materialcategorization:Fordefinitionsofcompliancepleaseseewww.vishay.com/doc?99912 | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
TOCHANGEWITHOUTNOTICEACCESSORIES | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 |
产品属性
- 产品编号:
PN-1333-DGMB
- 制造商:
Bud Industries
- 类别:
盒子,外壳,机架 > 箱
- 系列:
PN
- 包装:
散装
- 容器类型:
盒
- 大小 / 尺寸:
6.387" 长 x 3.246" 宽(162.23mm x 82.45mm)
- 高度:
3.346"(85.00mm)
- 面积 (L x W):
20.7in²(134cm²)
- 设计:
包含盖
- 材料:
塑料 - ABS
- 颜色:
灰色
- 厚度:
0.118"(3.00mm)
- 特性:
卡导槽,安装法兰,PCB 支架
- 等级:
IP65,NEMA 1,2,4,4X,12,13,UL-508
- 材料可燃性等级:
UL94 HB
- 描述:
BOX ABS GRAY 6.387\
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
BUDINDUSTRIESRADIO |
新 |
415 |
全新原装 货期两周 |
询价 | |||
Bud |
22+ |
NA |
317 |
加我QQ或微信咨询更多详细信息, |
询价 | ||
Bud Industries |
2022+ |
57 |
全新原装 货期两周 |
询价 | |||
BUD INDUSTRIES |
2306+ |
NA |
6680 |
原装正品公司现货,实单来谈 |
询价 |
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