Description

The OPB821TX or OPB821TXV consists of a gallium aluminum arsenide LED and a silicon phototransistor soldered into a printed circuit board, then mounted in a high temperature plastic housing on opposite sides of an 0.080 inch (2.03 mm) wide slot. Lead wires are #24 AWG polytetraflouroethylene (PTFE) insulated conforming to MIL-W-16878. Phototransistor switching takes place whenever an opaque object passes through the slot. For maximum output signal, neither the LED or the phototransistor in the OPB821TX or the OPB821TXV is apertured. The OPB821TX and OPB821TXV use optoelectronic components that have been processed and tested as either TX or TXV components per MIL-PRF-19500. Typical screening and lot acceptance tests are provided on page 13-4.

Fea tures

•·Non-contact switching

•·Hermetically sealed components

•·Components processed to Optek’s screening program patterned after MIL-PRF-19500 for TX and TXV devices