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NXH50C120L2C2ESG_V01中文资料安森美半导体数据手册PDF规格书

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厂商型号

NXH50C120L2C2ESG_V01

功能描述

TMPIM 50 A CIB/CI Module

文件大小

420.11 Kbytes

页面数量

12

生产厂商

ONSEMI

中文名称

安森美半导体

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-11-2 9:30:00

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NXH50C120L2C2ESG_V01价格和库存,欢迎联系客服免费人工找货

NXH50C120L2C2ESG_V01规格书详情

The NXH50C120L2C2ESG is a transfer−molded power module

with low thermal resistance substrate containing

a converter-inverter-brake circuit consisting of six 50 A, 1600 V

rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, one 35 A,

1200 V brake IGBT with brake diode and an NTC thermistor.

The NXH50C120L2C2ES1G is a transfer−molded power module

with low thermal resistance substrate containing a converter−inverter

circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V

IGBTs with inverse diodes, and an NTC thermistor.

特性 Features

• Low Thermal Resistance Substrate for Low Thermal Resistance

• Lower Package Height than Standard Case Modules

• 6 mm Clearance distance between pin to heatsink

• Compact 73 mm × 40 mm × 8 mm Package

• Solderable Pins

• Thermistor

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

Typical Applications

• Industrial Motor Drives

• Servo Drives

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恩XP
25+
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恩XP
24+
SMD
15600
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ON-SEMI
22+
N/A
1440
只做原装正品
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24+
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一级代理-主营优势-实惠价格-不悔选择
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恩XP
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13-WLCSP (2.8x2.74)
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con
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SAMYOUNG
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恩XP
24+
WLCSP13
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现货供应,当天可交货!免费送样,原厂技术支持!!!
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恩XP
21+
48-VFBGA
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进口原装!长期供应!绝对优势价格(诚信经营
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