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零件编号	下载&订购	功能描述	制造商&上传企业	LOGO
ACDBQC0230R-HF	文件：477.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -AEC-Q101Qualified.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
ACDBUC0230-HF	文件：102 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
ALN0230	文件：214.78 Kbytes Page：3 Pages	InternallyMatchedLNAModule	ASB Advanced Semiconductor Business Inc.	ASB
ALN0230	文件：396.64 Kbytes Page：3 Pages	InternallyMatchedLNAModule	ASB Advanced Semiconductor Business Inc.	ASB
AR0230	文件：959.34 Kbytes Page：36 Pages	FullHDDigitalImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
AR0230CS	文件：864.75 Kbytes Page：33 Pages	1/2.7-Inch2.1Mp/FullHDDigitalImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
AR0230CS	文件：181.11 Kbytes Page：24 Pages	1/2.7?릋nch2.1Mp/FullHDDigitalImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
ASB0230	文件：143.43 Kbytes Page：3 Pages	SMDSchottkyBarrierDiode Features IO=200mA VR=30V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowdrop-downvoltage. -Majoritycarrierconduction -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,sold	ANACHIP 易亨易亨电子股份有限公司	ANACHIP
B0230D	文件：1.19922 Mbytes Page：4 Pages	N-ChannelMOSFETusesadvancedtrenchtechnology	DOINGTERSHENZHEN DOINGTER SEMICONDUCTOR CO., LTD. 杜因特深圳市杜因特半导体有限公司	DOINGTER
CDBER0230L	文件：203.05 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0230L-HF	文件：203.23 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0230R	文件：201.49 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0230R-HF	文件：201.77 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBERT0230R	文件：130.84 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230	文件：65.65 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230-HF	文件：200.87 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230L	文件：124 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230L-HF	文件：152.4 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230R	文件：124.43 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230R-HF	文件：201.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solde	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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供应商	型号	品牌	批号	封装	库存	备注	价格
深圳市勤思达科技有限公司	MX0230	MX	23+	DIP8	8500	全新原装现货,公司只做原装。	询价
深圳市近平电子有限公司	MX0230	MX	07+	DIP8	6000	绝对原装自己现货	询价
深圳市汇创佳电子科技有限公司	MX0230	MX	22+	DAP	4258	原装正品价格优势	询价
深圳市佳杰伟业科技有限公司	MX0230	MX	2315+	DIP8	3986	优势代理渠道,原装现货,可全系列订货	询价
深圳市佳鑫美电子科技有限公司	MX029	CML	22+	SOP	3200	十年品牌!原装现货!!!	询价
深圳市星佑电子有限公司	MX0290064	ST		DIP28	1344	全新原装100真实现货供应	询价
深圳市一线半导体有限公司	MX0297922			SMD	5000	公司存货	询价
深圳市毅创腾电子科技有限公司	MX029DW	MX-COM	23+	SOP	7000	绝对全新原装!现货!特价!请放心订购!	询价
深圳市科恒伟业电子有限公司	MX029DW	CML	2016+	SOP16	6528	只做原厂原装现货!终端客户个别型号可以免费送样品!	询价
深圳市弘为电子有限公司	MX029DW	MX-COM	16+	SMD	1122	原装现货假一罚十	询价

更多MX0230供应商更新时间2024-6-16 16:00:00

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