MECHANICAL CHARACTERISTICS

DESCRIPTION/FEATURES □ HermeticallySealed Glass Packages (DO-35) □ High Reverse Breakdown and Low Leakage □ Excellent Low VoltageRegulation □ Controlled Stored Charge □ Planar Passivated Die Elements APPLICATION These axial lead diodes represent configurations of one to four* p-n junctio

文件：104.68 Kbytes 页数：2 Pages

NJSEMINew Jersey Semi-Conductor Products, Inc.

新泽西半导体新泽西半导体公司

MECHANICAL CHARACTERISTICS

DESCRIPTION/FEATURES □ HermeticallySealed Glass Packages (DO-35) □ High Reverse Breakdown and Low Leakage □ Excellent Low VoltageRegulation □ Controlled Stored Charge □ Planar Passivated Die Elements APPLICATION These axial lead diodes represent configurations of one to four* p-n junctio

文件：104.68 Kbytes 页数：2 Pages

NJSEMINew Jersey Semi-Conductor Products, Inc.

新泽西半导体新泽西半导体公司

FAIRCHILD/仙童
TO-92

FAIRCHILD/仙童

上传：深圳广友电子有限公司

MICROCHIP/微芯
BGA-784

MICROCHIP/微芯

上传：深圳市宇集芯电子有限公司

NXP

恩XP

上传：北京三盛恒业电子有限公司