首页 >MMBZ5251BLTIG>规格书列表
零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
---|---|---|---|---|
200mWSURFACEMOUNTZENERDIODE Features •PlanarDieConstruction •DualIsolatedZenersinUltra-SmallSurfaceMountPackage •IdeallySuitedforAutomatedAssemblyProcesses •LeadFree/RoHSCompliant(Note2) •GreenDevice(Note3and4) | DIODES Diodes Incorporated | DIODES | ||
200mWSURFACEMOUNTZENERDIODE | DIODES Diodes Incorporated | DIODES | ||
PlanarDieConstruction Features •PlanarDieConstruction •DualIsolatedZenersinUltra-SmallSurfaceMountPackage •IdeallySuitedforAutomatedAssemblyProcesses •LeadFree/RoHSCompliant(Note5) | SKTECHNOLGYSHIKE Electronics 時科广东時科微实业有限公司 | SKTECHNOLGY | ||
150mWSURFACEMOUNTZENERDIODE | DIODES Diodes Incorporated | DIODES | ||
150mWSURFACEMOUNTZENERDIODE Features •Ultra-SmallSurfaceMountPackage •PlanarDieConstruction •GeneralPurpose •IdeallySuitedforAutomatedAssemblyProcesses •LeadFree/RoHSCompliant(Note2) •GreenDevice(Note3and4) | DIODES Diodes Incorporated | DIODES | ||
150mWSURFACEMOUNTZENERDIODE Features •Ultra-SmallSurfaceMountPackage •PlanarDieConstruction •GeneralPurpose •IdeallySuitedforAutomatedAssemblyProcesses •LeadFree/RoHSCompliant(Note2) •GreenDevice(Note3and4) | DIODES Diodes Incorporated | DIODES | ||
TRIPLESURFACEMOUNTZENERDIODEARRAY Features •ThreeIsolatedZenersinUltra-SmallSurfaceMountPackage •IdeallySuitedforAutomatedAssemblyProcesses •TotallyLead-Free&FullyRoHSCompliant(Notes1&2) •HalogenandAntimonyFree.“Green”Device(Note3) •QualifiedtoAEC-Q101StandardsforHighReliability | DIODES Diodes Incorporated | DIODES | ||
TRIPLESURFACEMOUNTZENERDIODEARRAY | DIODES Diodes Incorporated | DIODES | ||
TRIPLESURFACEMOUNTZENERDIODEARRAY Features •ThreeIsolatedZenersinUltra-SmallSurfaceMountPackage •IdeallySuitedforAutomatedAssemblyProcesses •LeadFree/RoHSCompliant(Note3) •QualifiedtoAEC-Q101StandardsforHighReliability •GreenDevice(Note4and5) | DIODES Diodes Incorporated | DIODES | ||
TRIPLEISOLATED200mWZENERS ThisnewPANJITfamilyoftriple,isolatedZenerscomesintheverysmallSOT-363package.Itsverysmallfootprintmakesitidealforapplicationswhereboardspaceisapremium. SPECIFICATIONFEATURES ●LowProfile(typ.0.9mm)SOT-363Package ●5Tolerance(2Optional) ●WorkingPeakRever | PANJITPan Jit International Inc. 强茂強茂股份有限公司 | PANJIT | ||
SURFACEMOUNTSILICONZENERDIODES | PANJITPan Jit International Inc. 强茂強茂股份有限公司 | PANJIT | ||
SURFACEMOUNTSILICONZENERDIODES VOLTAGE2.4to75VoltsPOWER200mWatts FEATURES •PlanarDieconstruction •200mWPowerDissipation •ZenerVoltagesfrom2.4V~75V •IdeallySuitedforAutomatedAssemblyProcesses •Pbfreeproduct:99SnabovecanmeetRoHS environmentsubstancerequest MECHANICALDATA •Case:SOD | PANJITPan Jit International Inc. 强茂強茂股份有限公司 | PANJIT | ||
SURFACEMOUNTSILICONZENERDIODES VOLTAGE2.4to51VoltsPOWER200mWatts FEATURES •PlanarDieconstruction •200mWPowerDissipation •ZenerVoltagesfrom2.4V~51V •IdeallySuitedforAutomatedAssemblyProcesses •IncompliancewithEURoHS2002/95/ECdirectives | PANJITPan Jit International Inc. 强茂強茂股份有限公司 | PANJIT | ||
200mWSURFACEMOUNTZENERDIODE Features •PlanarDieConstruction •Ultra-SmallSurfaceMountPackage •GeneralPurpose •IdeallySuitedforAutomatedAssemblyProcesses •LeadFree/RoHSCompliant(Note2) •QualifiedtoAEC-Q101StandardsforHighReliability •GreenDevice(Notes3and4) | DIODES Diodes Incorporated | DIODES | ||
SurfaceMountZenerDiode Features: *PlanarDieConstruction *200mWPowerDissipationonFR-4PCB *Generalpurpose,MediumCurrent *IdeallySuitedforAutomatedAssembly | WEITRON Weitron Technology | WEITRON | ||
200mWSURFACEMOUNTZENERDIODE | DIODES Diodes Incorporated | DIODES | ||
200mWSURFACEMOUNTZENERDIODE Features ●PlanarDieConstruction ●200mWPowerDissipation ●2.4–51VNominalZenerVoltage ●5StandardVzTolerance ●DesignedforSurfaceMountApplication ●PlasticMaterial–ULRecognitionFlammabilityClassification94V-O | WTEWon-Top Electronics 毅星電子毅星电子股份有限公司 | WTE | ||
SURFACEMOUNTSILICONZENERDIODES | PANJITPan Jit International Inc. 强茂強茂股份有限公司 | PANJIT | ||
SURFACEMOUNTSILICONZENERDIODES | PANJITPan Jit International Inc. 强茂強茂股份有限公司 | PANJIT | ||
SILICONPLANARZENERDIODES SILICONPLANARZENERDIODES | HTSEMIShenzhen Jin Yu Semiconductor Co., Ltd. 金誉半导体深圳市金誉半导体股份有限公司 | HTSEMI |
详细参数
- 型号:
MMBZ5251BLTIG
- 制造商:
Rochester Electronics LLC
- 制造商:
ON Semiconductor
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
KEC |
22+ |
SOT-23 |
28600 |
只做原装正品现货假一赔十一级代理 |
询价 | ||
KEC |
23+ |
SOT-23 |
50000 |
全新原装正品现货,支持订货 |
询价 | ||
KEC |
23+ |
SOT-23 |
50000 |
全新原装正品现货,支持订货 |
询价 | ||
KEC |
2022 |
SOT-23 |
80000 |
原装现货,OEM渠道,欢迎咨询 |
询价 | ||
KEC |
SOT-23 |
68900 |
原包原标签100%进口原装常备现货! |
询价 | |||
KEC |
23+ |
SOT-23 |
13000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
询价 | ||
KEC |
21+ |
SOT-23 |
12800 |
只有原装 ,可支持实单 |
询价 | ||
KEC |
10+ |
SOT-23 |
1900 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
询价 | ||
BPS |
2022+ |
SOT335 |
6000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
询价 | ||
BPS |
24+ |
SOT335 |
24225 |
询价 |
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相关库存
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