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MC00625W04021619R中文资料易络盟数据手册PDF规格书
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MC00625W04021619R规格书详情
特性 Features
• Small size and light weight
• Suitable for both wave and reflow soldering
• Reduction of assembly costs
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MULTICOMP |
2022+ |
10000 |
全新原装 货期两周 |
询价 |
