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MBF

SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS

FEATURES ♦Idealforprintedcircuitboard ♦Reliablelowcostconstructionutilizingmoldedplastictechnique ♦Hightemperaturesolderingguaranteed:260*/10secondsat5lbs.,(2.3kg)tension ♦Smallsize,simpleinstallation ♦LeadssolderableperMIL-STD-202,Method208 ♦Highsurgecur

SHUNYEShunye Enterprise

顺烨电子江苏顺烨电子有限公司

MBF

包装:散装 类别:RF/IF,射频/中频和 RFID RF 配件 描述:ACCY MOUNT BMM 3/4\

TE Connectivity Laird

TE Connectivity Laird

TE Connectivity Laird

MBF10

Schottky Surface Mount Flat Bridge Rectifier

Features ◇Lowprofilepackage ◇Idealforautomatedplacement ◇Ultrafastreverserecoverytime ◇Lowpowerlosses,highefficiency ◇Lowforwardvoltagedrop ◇Highsurgecapability ◇Hightemperaturesoldering:260℃/10secondsatterminals

LUGUANGShenzhen Luguang Electronic Technology Co., Ltd

鲁光电子深圳市鲁光电子科技有限公司

MBF10J

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世纪微电子常州银河世纪微电子股份有限公司

MBF10K

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世纪微电子常州银河世纪微电子股份有限公司

MBF10M

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世纪微电子常州银河世纪微电子股份有限公司

MBF10N

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世纪微电子常州银河世纪微电子股份有限公司

MBF110

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF110PFW1LPES

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF110PFW1LPG

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF110PFW1STES

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF110PFW1STG

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF110PFWLPES

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF110PFWLPG

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF110PFWSTES

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF110PFWSTG

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsū Kabushiki-gaisha

富士通富士通株式会社

MBF15M

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世纪微电子常州银河世纪微电子股份有限公司

MBF15T65PEH

650V Field Stop IGBT

GeneralDescription ThisIGBTisproducedusingadvancedMagnaChip’sFieldStopTrenchIGBTTechnology,whichprovideshighperformance,excellentqualityandhighruggedness. Thisdeviceisformotorcontrol. Features ■Highruggednessformotorcontrol ■VCE(sat)positivetemperaturecoeffi

MGCHIP

MagnaChip Semiconductor.

MBF2-MBF10

Low profile package

Features ◇Lowprofilepackage ◇Idealforautomatedplacement ◇Ultrafastreverserecoverytime ◇Lowpowerlosses,highefficiency ◇Lowforwardvoltagedrop ◇Highsurgecapability ◇Hightemperaturesoldering:260℃/10secondsatterminals

LUGUANGShenzhen Luguang Electronic Technology Co., Ltd

鲁光电子深圳市鲁光电子科技有限公司

MBF2-MBF10

Low profile package

Features ◇Lowprofilepackage ◇Idealforautomatedplacement ◇Ultrafastreverserecoverytime ◇Lowpowerlosses,highefficiency ◇Lowforwardvoltagedrop ◇Highsurgecapability ◇Hightemperaturesoldering:260℃/10secondsatterminals

LUGUANGShenzhen Luguang Electronic Technology Co., Ltd

鲁光电子深圳市鲁光电子科技有限公司

产品属性

  • 产品编号:

    MBF

  • 制造商:

    TE Connectivity Laird

  • 类别:

    RF/IF,射频/中频和 RFID > RF 配件

  • 包装:

    散装

  • 配件类型:

    安装

  • 描述:

    ACCY MOUNT BMM 3/4\

供应商型号品牌批号封装库存备注价格
LAIRD
20+
射频元件
155
就找我吧!--邀您体验愉快问购元件!
询价
麦科
15+
0805
3020
现货-ROHO
询价
MOTOROLA
69000
现货供应
询价
日立
23+
模块
3562
询价
HITACHI
23+
模块
350
全新原装正品,量大可订货!可开17%增值票!价格优势!
询价
ASJ
06+
原厂原装
9216
只做全新原装真实现货供应
询价
MOTOROLA
16+
CAN
280
原装现货假一罚十
询价
OKI
23+
CAN3
5000
原装正品,假一罚十
询价
OKI
22+
QFN
6980
原装现货,可开13%税票
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FUJ
2339+
SSOP
4652
公司原厂原装现货假一罚十!特价出售!强势库存!
询价
更多MBF供应商 更新时间2021-9-14 10:50:00