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MAX6691MUB+T

包装:散装 封装/外壳:10-TFSOP,10-MSOP(0.118",3.00mm 宽) 类别:集成电路(IC) 传感器和检测器接口 描述:IC TEMP-TO-PULSE WIDTH 10-UMAX

ADAnalog Devices

亚德诺亚德诺半导体技术有限公司

6691A

SystemDCPowerSupply

KEYSIGHTKeysight Technologies

德科技(中国德科技(中国)有限公司

IRF6691

HEXFETPowerMOSFETplusSchottkyDiode

HEXFETPowerMOSFETplusSchottkyDiode ●ApplicationSpecificMOSFETs ●IntegratesMonolithicTrenchSchottkyDiode ●IdealforCPUCoreDC-DCConverters ●LowConductionLosses ●LowReverseRecoveryLosses ●LowSwitchingLosses ●LowReverseRecoveryChargeandLowVf ●LowProfile(

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF6691PBF

DirectFETPowerMOSFET

Description TheIRF6691PbFcombinesthelatestHEXFET®PowerMOSFETSilicontechnologywiththeadvancedDirectFETTMpackagingtoachievetheloweston-stateresistanceinapackagethathasthefootprintofaSO-8andonly0.7mmprofile.TheDirectFETpackageiscompatiblewithexistinglayout

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF6691PBF

RoHsCompliant

Description TheIRF6691PbFcombinesthelatestHEXFET®PowerMOSFETSilicontechnologywiththeadvancedDirectFETTMpackagingtoachievetheloweston-stateresistanceinapackagethathasthefootprintofaSO-8andonly0.7mmprofile.TheDirectFETpackageiscompatiblewithexistinglayout

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF6691TRPBF

RoHsCompliant

Description TheIRF6691PbFcombinesthelatestHEXFET®PowerMOSFETSilicontechnologywiththeadvancedDirectFETTMpackagingtoachievetheloweston-stateresistanceinapackagethathasthefootprintofaSO-8andonly0.7mmprofile.TheDirectFETpackageiscompatiblewithexistinglayout

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF6691TRPBF

DirectFETPowerMOSFET

Description TheIRF6691PbFcombinesthelatestHEXFET®PowerMOSFETSilicontechnologywiththeadvancedDirectFETTMpackagingtoachievetheloweston-stateresistanceinapackagethathasthefootprintofaSO-8andonly0.7mmprofile.TheDirectFETpackageiscompatiblewithexistinglayout

IRFInternational Rectifier

英飞凌英飞凌科技公司

MAX6691

Four-ChannelThermistorTemperature-to-Pulse-WidthConverter

MaximMaximIntegrated

美信半导体

MAX6691

Four-ChannelThermistorTemperature-to-Pulse-WidthConverter

MaximMaximIntegrated

美信半导体

MAX6691MUB

Four-ChannelThermistorTemperature-to-Pulse-WidthConverter

MaximMaximIntegrated

美信半导体

MAX6691MUB

Four-ChannelThermistorTemperature-to-Pulse-WidthConverter

MaximMaximIntegrated

美信半导体

ML6691

100BASE-TMII-to-PMDTransceiver

GENERALDESCRIPTION TheML6691implementstheupperportionofthephysicallayerfortheFastEthernet100BASE-Tstandard.FunctionscontainedintheML6691includea4B/5Bencoder/decoder,aStreamCipherscrambler/descrambler,andcollisiondetect.AdditionalfunctionsoftheML6691—accessi

MICRO-LINEARMicro Linear Corporation

Micro Linear Corporation

ML6691CQ

100BASE-TMII-to-PMDTransceiver

GENERALDESCRIPTION TheML6691implementstheupperportionofthephysicallayerfortheFastEthernet100BASE-Tstandard.FunctionscontainedintheML6691includea4B/5Bencoder/decoder,aStreamCipherscrambler/descrambler,andcollisiondetect.AdditionalfunctionsoftheML6691—accessi

MICRO-LINEARMicro Linear Corporation

Micro Linear Corporation

MSM6691

DRAMInterfaceIC

OKIOki Electric Cable Co.,Ltd

冲电线冲电线株式会社

SP6691

SOT23MicroPowerBoostRegulatorSeriesWhiteLEDDriver

SipexSipex Corporation

西伯斯|迈凌西伯斯公司

SP6691

MicroPowerBoostRegulatorSeriesWhiteLEDDriver

DESCRIPTION TheSP6691isamicropowerboostregulatorthatisspecificallydesignedforpoweringseriesconfigurationwhiteLED.Thepartutilizesfixedofftimearchitectureandconsumesonly10nAquiescentcurrentinshutdown.Lowvoltageoperation,downto1V,fullyutilizesmaximalbattery

SipexSipex Corporation

西伯斯|迈凌西伯斯公司

SP6691EB

EvaluationBoardManual

DESCRIPTIONANDBOARDSCHEMATIC TheSP6691EBEvaluationBoardisdesignedtohelptheuserevaluatetheperformanceoftheSP6691EBasaserieswhiteLEDdriver.TheevaluationboardisacompletelyassembledandtestedsurfacemountboardwhichprovideseasyprobeaccesspointstoallSP6691EBI

SipexSipex Corporation

西伯斯|迈凌西伯斯公司

SP6691EK

SOT23MicroPowerBoostRegulatorSeriesWhiteLEDDriver

SipexSipex Corporation

西伯斯|迈凌西伯斯公司

SP6691EK/TR

SOT23MicroPowerBoostRegulatorSeriesWhiteLEDDriver

SipexSipex Corporation

西伯斯|迈凌西伯斯公司

SP6691ER

SOT23MicroPowerBoostRegulatorSeriesWhiteLEDDriver

SipexSipex Corporation

西伯斯|迈凌西伯斯公司

产品属性

  • 产品编号:

    MAX6691MUB+T

  • 制造商:

    Analog Devices Inc./Maxim Integrated

  • 类别:

    集成电路(IC) > 传感器和检测器接口

  • 包装:

    散装

  • 类型:

    温度传感器

  • 输入类型:

    逻辑

  • 输出类型:

    电压

  • 工作温度:

    -55°C ~ 125°C

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    10-TFSOP,10-MSOP(0.118",3.00mm 宽)

  • 供应商器件封装:

    10-uMAX/uSOP

  • 描述:

    IC TEMP-TO-PULSE WIDTH 10-UMAX

供应商型号品牌批号封装库存备注价格
Analog Devices Inc./Maxim Inte
24+
10-TFSOP,10-MSOP(0.118,3.00
25000
in stock接口IC-原装正品
询价
MAXIM/美信
21+
MSOP-10
9850
只做原装正品假一赔十!正规渠道订货!
询价
MAXIM
24+
10MSOP
5000
只做原装公司现货
询价
MAXIM
19+
10MSOP
256800
原厂代理渠道,每一颗芯片都可追溯原厂;
询价
23+
N/A
35700
正品授权货源可靠
询价
Maxim Integrated
21+
10-uMAX
53200
一级代理/放心采购
询价
MAXIM/美信
23+
MSOP-10
25500
授权代理直销,原厂原装现货,假一罚十,特价销售
询价
Maxim
1931+
N/A
567
加我qq或微信,了解更多详细信息,体验一站式购物
询价
MAXIM/美信
21+
10MSOP
50000
终端可免费提供样品,欢迎咨询
询价
MAXIM
20+
MSOP-10
2500
就找我吧!--邀您体验愉快问购元件!
询价
更多MAX6691MUB+T供应商 更新时间2024-5-24 23:07:00