Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (T;

MACOM

Attenuator DIE

文件：460.03 Kbytes 页数：3 Pages

MA-COM

Package：模具；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 衰减器 描述：RF ATTENUATOR 20DB DIE

MACOM Technology Solutions

10.0 AMPS. Schottky Barrier Rectifiers

FEATURES - Low power loss, high efficiency - Guardring for overvoltage protection - High surge current capability - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition

文件：56.31 Kbytes 页数：2 Pages

TSC

台湾半导体

Wide Temperature Range and High Tjm Schottky Barrier Rectifiers

FEATURES * International standard package * Very low VF * Extremely low switching losses * Low IRM-values APPLICATIONS * Rectifiers in switch mode power supplies (SMPS) * Free wheeling diode in low voltage converters ADVANTAGES * High reliability circuit operation * Low voltage peaks for

文件：166 Kbytes 页数：2 Pages

SIRECTIFIER

矽莱克电子

10.0 AMPS. Schottky Barrier Rectifiers

文件：613.1 Kbytes 页数：2 Pages

TSC

台湾半导体