This device was designed for low profile consumer applications.

Features - Package: SMT package, epoxy resin - Chip technology: InGaAlP / InGaN on Sapphire - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 530 nm (● true green); λdom = 623 nm (● red); λdom = 472 nm (● blue) - ESD: 500 V acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 1B) - Color: x

文件：2.45697 Mbytes 页数：32 Pages

AMSCO

艾迈斯欧司朗

This device was designed for low profile consumer applications.

Features - Package: SMT package, epoxy resin - Chip technology: InGaAlP / InGaN on Sapphire - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 530 nm (● true green); λdom = 623 nm (● red); λdom = 472 nm (● blue) - ESD: 500 V acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 1B) - Color: x

文件：2.45697 Mbytes 页数：32 Pages

AMSCO

艾迈斯欧司朗

OSRAM Multi Chip LED, LTRBR37G

该产品专为紧凑型消费类应用而设计。4 引脚共阳极技术可通过独立驱动每个芯片来实现红色、绿色和蓝色的颜色混合。该封装尺寸极其小巧紧凑，高度低，适用于显示器和集成度较高的消费类应用。该产品具有白光的颜色分bin。

ams-OSRAM

艾迈斯欧司朗

LEM
传感器

LEM

莱姆

上传：深圳市鹏华威电子有限公司

LITEON/光宝
0805

LITEON/光宝

上传：深圳市向鸿伟业电子有限公司