LT0H33P中文资料夏普微数据手册PDF规格书

■ Features

(1) Enables to design compact pick-up thanks to compact package. (Thickness; 4.8mm)

(2) Since its semiconductor laser, signal detection photocell, and circuit array are assembled in a package, the optical pick is simple in assembling and adjustment

(3) The adjustment during pickup assembly is eased and can easily be automated.

■ Applications

(1) MD players