LCMXO2-1200ZE-3TG144C集成电路（IC）的FPGA（现场可编程门阵列）规格书PDF中文资料

Features

Flexible Logic Architecture

• Six devices with 256 to 6864 LUT4s and 19 to 335 I/Os

Ultra Low Power Devices

• Advanced 65 nm low power process

• As low as 19 µW standby power

• Programmable low swing differential I/Os

• Stand-by mode and other power saving options

Embedded and Distributed Memory

• Up to 240 Kbits sysMEM™ Embedded Block RAM

• Up to 54 Kbits Distributed RAM

• Dedicated FIFO control logic On-Chip User Flash Memory

• Up to 256 Kbits of User Flash Memory

• 100,000 write cycles

• Accessible through WISHBONE, SPI, I2C and JTAG interfaces

• Can be used as soft processor PROM or as Flash memory

Pre-Engineered Source Synchronous I/O

• DDR registers in I/O cells

• Dedicated gearing logic

• 7:1 Gearing for Display I/Os

• Generic DDR, DDRX2, DDRX4

• Dedicated DDR/DDR2/LPDDR memory with DQS support

High Performance, Flexible I/O Buffer

• Programmable sysIO™ buffer supports wide range of interfaces:

– LVCMOS 3.3/2.5/1.8/1.5/1.2

– LVTTL

–PCI

– LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL

– SSTL 25/18

– HSTL 18

– Schmitt trigger inputs, up to 0.5V hysteresis

• I/Os support hot socketing

• On-chip differential termination

• Programmable pull-up or pull-down mode