Automotive rear door device with CAN FD and LIN

Features • AEC-Q100 qualified • 1 half bridge for 7.5 A load (RON = 100 mΩ) • 1 half bridge for 6 A load (RON = 150 mΩ) • 1 half bridge for 3 A load (RON = 300 mΩ) • 1 configurable high-side driver for up to 1.5 A (RON = 300 mΩ) or 0.35 A (RON = 1600 mΩ) load • 2 high-side drivers for 0.5 A

文件：8.39455 Mbytes 页数：146 Pages

STMICROELECTRONICS

意法半导体

Automotive rear door device with CAN FD and LIN

Features • AEC-Q100 qualified • 1 half bridge for 7.5 A load (RON = 100 mΩ) • 1 half bridge for 6 A load (RON = 150 mΩ) • 1 half bridge for 3 A load (RON = 300 mΩ) • 1 configurable high-side driver for up to 1.5 A (RON = 300 mΩ) or 0.35 A (RON = 1600 mΩ) load • 2 high-side drivers for 0.5 A

文件：8.39455 Mbytes 页数：146 Pages

STMICROELECTRONICS

意法半导体

SSOP36

ST/意法

上传：深圳市粤骏腾电子科技有限公司