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IRKT26

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26

POWER MODULE

IRI

IRI

IRI

IRKT26/04A

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/04AS90

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/04AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/06A

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/06AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/06AS90

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/08A

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/08AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/08AS90

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/10A

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/10AS90

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/10AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/12A

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/12AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/12AS90

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/14A

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/14AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

IRKT26/14AS90

ADD-A-pakTM GEN V Power Modules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRFInternational Rectifier

英飞凌英飞凌科技公司

IRF

详细参数

  • 型号:

    IRKT26

  • 制造商:

    IRF

  • 制造商全称:

    International Rectifier

  • 功能描述:

    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

供应商型号品牌批号封装库存备注价格
IRF
23+
NA
19960
只做进口原装,终端工厂免费送样
询价
IR
100
原装现货,价格优惠
询价
VishaySemiconductors
2022
ADD-A-PAK(3+4)
58
原厂原装正品,价格超越代理
询价
IR
23+
27A1600V
620
全新原装正品,量大可订货!可开17%增值票!价格优势!
询价
IR
2015+
SMD/DIP
19889
一级代理原装现货,特价热卖!
询价
IR
2017+
MODULE
15858
深圳代理原装现货进口库存(香港-日本-台湾)开17点增票
询价
IR
23+
模块
3562
询价
VISHAY/IR
16+
原厂封装
310
原装现货假一罚十
询价
VishaySemiconductorDiode
23+
SCRDBLHISCR1600V27AADDAP
1690
专业代理销售半导体模块,能提供更多数量
询价
IR
1816+
module
6523
科恒伟业!只做原装正品,假一赔十!
询价
更多IRKT26供应商 更新时间2024-4-27 9:01:00