THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

Level controller 1-channel

The 1-channel level control MS91-12-R monitors and regulates conductive liquid levels (II). As a dual level regulator, it can be used to control pumps and solenoid valves (I). As monitoring device it is designed for run-dry or over flow protection. The sensitivity (liquid resistance) is adjus

文件：232.35 Kbytes 页数：2 Pages

TURCKTurck, Inc.

图尔克德国图尔克集团公司

AAP Gen 7 (TO-240AA) Power Modules Standard Diodes, 100 A

FEATURES High voltage Industrial standard package UL approved file E78996 Low thermal resistance Designed and qualified for industrial level Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 BENEFITS Excellent thermal performances obtained by the

文件：272.8 Kbytes 页数：9 Pages

VishayVishay Siliconix

威世威世科技公司