HZU5.1B2TRF-E技术资料参数供应代理安世-114ic电子网

零件编号	下载订购	功能描述/丝印	制造商上传企业	LOGO
HZU5.1B2	文件：100.59 Kbytes Page：11 Pages	SiliconEpitaxialPlanarZenerDiodesforStabilizer Features •UltrasmallResinPackage(URP)issuitableforsurfacemountdesign. •Thesediodesaredeliveredtaped.	RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司	RENESAS
PZU5.1B2	文件：64.61 Kbytes Page：12 Pages	SingleZenerdiodesinaSOD323Fpackage	PhilipsPhilips Semiconductors 飞利浦荷兰皇家飞利浦	Philips
PZU5.1B2L	文件：261.269 Kbytes Page：12 Pages	SingleZenerdiodesinaSOD882package 1.1.Generaldescription General-purposeZenerdiodesinaSOD882leadlessultrasmallSurface-MountedDevice(SMD) plasticpackage. 1.2.Features •Non-repetitivepeakrerversepowerdissipation:PZSM≤40W •Totalpowerdissipation:Ptot≤250mW •Toleranceseries:B:approximately±5	NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司	NEXPERIA
RKZ5.1B2KJ	文件：66.05 Kbytes Page：7 Pages	SiliconPlanarZenerDiodeforSurgeAbsorptionandStabilizer Features •EmbossTapingReelPack. •UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign.	RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司	RENESAS

更多HZU5.1B2TRF-E供应商更新时间2025-6-30 10:50:00