High Performance ChipLED

Description These chip LEDs are designed in an industry standard package for ease of handling and use. Various different LED colors are available in nine compact, single color packages. Features • Small size • Industry standard footprint • Compatible with IR solder • Diffused optics • Opera

文件：420.99 Kbytes 页数：11 Pages

AVAGO

安华高

Product Obsolescence Notification

文件：229.1 Kbytes 页数：6 Pages

AVAGO

安华高

High Performance ChipLED

文件：191.36 Kbytes 页数：9 Pages

BOARDCOM

博通

High Performance ChipLED

文件：230.36 Kbytes 页数：11 Pages

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Broadcom HSMC-C170 High Performance ChipLED

This chip-type LED utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available color in this surface mount is 626 nm Red for AS AlInGaP.Thi •HighbrightnessAlInGaPmaterial\n•Smallsize\n•Industrystandardfootprint\n•Diffusedoptics\n•Topemittingorrightangleemitting\n•Availablein3colors(red,orange,amber)\n•CompatiblewithIRsoldering\n•Availablein8mmtapeon7\"diameterreel\n•Reelsealedinziplockedmoisturebarrierbags;

Broadcom

博通

Package：0805（2012 公制）；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：光电器件 LED 指示 - 分立 描述：LED RED DIFFUSED CHIP SMD

Broadcom Limited

High Performance Surface Mount ChipLED

文件：1.24295 Mbytes 页数：10 Pages

BOARDCOM

博通

HSMC-C170-T0000 High Performance ChipLED

This chip-type LED utilizes AlInGaP material technology capable of producing high-light output over a wide range of drive currents.The package is binned by intensity.This chipLED comes in a top-emitting package. In order to facilitate pick-and-place operation, the chipLEDs are shipped in tape and re

Broadcom

博通

Package：0805（2012 公制）；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：光电器件 LED 指示 - 分立 描述：CHIP LED RED TOP MT ALINGAP

Broadcom Limited