integrated USB Type-C

文件：2.14584 Mbytes 页数：7 Pages

HMSEMI

华之美半导体

integrated USB Type-C

文件：2.14584 Mbytes 页数：7 Pages

HMSEMI

华之美半导体

Power MOSFET

Description The IRF6609 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout ge

文件：230.62 Kbytes 页数：10 Pages

IRF

HEXFET Power MOSFET

Description The IRF6618 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout ge

文件：234.56 Kbytes 页数：9 Pages

IRF

DirectFET짰Power MOSFET 짰

Description The IRF6618PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout

文件：240.91 Kbytes 页数：8 Pages

IRF