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GE28F160C3TA70中文资料PDF规格书
GE28F160C3TA70规格书详情
The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP, and 48-ball µBGA* packages.
■ Flexible SmartVoltage Technology
- 2.7 V–3.6 V Read/Program/Erase
- 2.7 V or 1.65 V I/O Option Reduces Overall System Power
- 12 V for Fast Production Programming
■ High Performance
- 2.7 V–3.6 V: 90 ns Max Access Time
- 3.0 V–3.6 V: 80 ns Max Access Time
■ Optimized Architecture for Code Plus Data Storage
- Eight 8-Kbyte Blocks, Top or Bottom Locations
- Up to Sixty-Three 64-KB Blocks
- Fast Program Suspend Capability
- Fast Erase Suspend Capability
■ Flexible Block Locking
- Lock/Unlock Any Block
- Full Protection on Power-Up
- WP# Pin for Hardware Block Protection
- VPP = GND Option
- VCC Lockout Voltage
■ Low Power Consumption
- 9 mA Typical Read Power
- 10 µA Typical Standby Power with Automatic Power Savings Feature
■ Extended Temperature Operation
- –40 °C to +85 °C
■ Easy-12 V
- Faster Production Programming
- No Additional System Logic
■ 128-bit Protection Register
- 64-bit Unique Device Identifier
- 64-bit User Programmable OTP Cells
■ Extended Cycling Capability
- Minimum 100,000 Block Erase Cycles
■ Flash Data Integrator Software
- Flash Memory Manager
- System Interrupt Manager
- Supports Parameter Storage, Streaming Data (e.g., voice)
■ Automated Word/Byte Program and Block Erase
- Command User Interface
- Status Registers
■ SRAM-Compatible Write Interface
■ Cross-Compatible Command Support
- Intel Basic Command Set
- Common Flash Interface
■ x 16 for High Performance
- 48-Ball µBGA* Package
- 48-Lead TSOP Package
■ x 8 I/O for Space Savings
- 48-Ball µBGA* Package
- 40-Lead TSOP Package
■ 0.25 µ ETOX™ VI Flash Technology
产品属性
- 型号:
GE28F160C3TA70
- 制造商:
INTEL
- 制造商全称:
Intel Corporation
- 功能描述:
Advanced+ Boot Block Flash Memory(C3)
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
INTEL/英特尔 |
22+ |
BGA |
8500 |
只做原装正品假一赔十!正规渠道订货! |
询价 | ||
INTEL |
2002 |
BGA |
4000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
询价 | ||
INTEL/英特尔 |
0251+ |
BGA |
3200 |
询价 | |||
INTEL |
23+ |
BGA |
8890 |
价格优势/原装现货/客户至上/欢迎广大客户来电查询 |
询价 | ||
INTEL |
21+ |
BGA |
7200 |
原装现货假一赔十 |
询价 | ||
INTEL/英特尔 |
24+23+ |
BGA |
12580 |
16年电子元件现货供应商 终端BOM表可配单提供样品 |
询价 | ||
INTEL/英特尔 |
23+ |
BGA |
90000 |
只做原厂渠道价格优势可提供技术支持 |
询价 | ||
INTEL |
BGA |
6000 |
原装现货,长期供应,终端可账期 |
询价 | |||
INTEL |
23+ |
SMD-BGA |
11888 |
专做原装正品,假一罚百! |
询价 | ||
INTEL/英特尔 |
2022 |
BGA |
80000 |
原装现货,OEM渠道,欢迎咨询 |
询价 |