首页 >GD277F>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
On-chipHallsensor | HSMCHi-Sincerity Mocroelectronics 华昕华昕科技有限公司 | HSMC | ||
BI-LEVELT-1(5mm)LEDHOLDERINTERLOCKINGVARIABLEINSIDEDIAMETER | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
GaAsMMICFUNDAMENTALMIXER,70-90GHz | Hittite Hittite Microwave Corporation | Hittite | ||
FCCE-BandCommunicationSystems | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | AD | ||
SiliconEpitaxialPlanarDiodeforUHF/VHFtunerBandSwitch Features •Lowforwardresistance.(rf=0.7Ωmax) •UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconEpitaxialPlanarDiodeforUHF/VHFtunerBandSwitch Features •Lowforwardresistance.(rf=0.7max) •UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconEpitaxialPlanarDiodeforUHF/VHFtunerBandSwitch Features •Lowforwardresistance.(rf=0.7Ωmax) •UltrasmallResinPackage(URP)issuitableforsurfacemountdesign. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconEpitaxialPlanarforUHF/VHFtunerBandSwitch Features •Lowforwardresistance.(rf=0.7Ωmax) •UltrasmallResinPackage(URP)issuitableforsurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
1Wepoxysealtype | TOSHIBAToshiba Semiconductor 东芝株式会社东芝 | TOSHIBA | ||
iscN-ChannelMOSFETTransistor | ISCInchange Semiconductor Company Limited 无锡固电无锡固电半导体股份有限公司 | ISC |
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