首页 >FRD854P>规格书列表
零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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DC-DCConverterApplications Features •CompositetypecomposedofalowON-resistanceP-channelMOSFETforultrahigh-speedswitchingandlow-voltagedrivingandafast-recovery,lowforward-voltageSchottkybarrierdiode.Facilitateshigh-densitymounting. •TheFX854isformedwith2chips,onebeingequivalenttothe2SJ | SANYOSanyo Semicon Device 三洋三洋电机株式会社 | SANYO | ||
FASTSWITCHINGPLASTICRECTIFIER FEATURES ♦PlasticpackagehasUnderwritersLaboratoryFlammabilityClassification94V-0 ♦Highsurgecurrentcapability ♦Fastswitchingforhighefficiency ♦Constructionutilizesvoid-freemoldedplastictechnique ♦Highforwardcurrentoperation ♦Hightemperaturesolderingguaranteed:2 | GE GE Industrial Company | GE | ||
FastSwitchingPlasticRectifier FEATURES •Fastswitchingforhighefficiency •Lowforwardvoltagedrop •Lowleakagecurrent •Highforwardsurgecapability •Solderdip275°Cmax.10s,perJESD22-B106 •ComplianttoRoHSdirective2002/95/ECandin accordancetoWEEE2002/96/EC TYPICALAPPLICATIONS Forusei | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
FastSwitchingPlasticRectifier FEATURES •Fastswitchingforhighefficiency •Lowforwardvoltagedrop •Lowleakagecurrent •Highforwardsurgecapability •Solderdip275°Cmax.10s,perJESD22-B106 •Materialcategorization:Fordefinitionsofcompliance pleaseseewww.vishay.com/doc?99912 TYPICALAPPLICATIONS | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
MiniatureIntegratedPowerMonitor | JDSUJDS Uniphase Corporation 捷迪讯 | JDSU | ||
MiniatureIntegratedPowerMonitor | JDSUJDS Uniphase Corporation 捷迪讯 | JDSU | ||
EPITAXIALPLANARNPNTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式会社 | KEC | ||
EPITAXIALPLANARNPNTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式会社 | KEC | ||
LMV851/LMV852/LMV8548MHzLowPowerCMOS,EMIHardenedOperationalAmplifiers | TI1Texas Instruments 德州仪器美国德州仪器公司 | TI1 | ||
8MHzLowPowerCMOS,EMIHardenedOperationalAmplifiers | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | NSC |
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