| 零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
|---|---|---|---|---|
LeadlessSurfaceMount | CTSCTS Electronic Components 西迪斯西迪斯公司 | CTS | ||
QUADRATUREHYBRID | APITECH API Technologies Corp | APITECH | ||
GROMMETS,BUSHINGS | etc2List of Unclassifed Manufacturers etc2未分类制造商 | etc2 | ||
OctaveBandandBroadband | APITECH API Technologies Corp | APITECH | ||
QUADRATUREHYBRID | APITECH API Technologies Corp | APITECH | ||
QUADRATUREHYBRID | APITECH API Technologies Corp | APITECH | ||
DirectionalCouplers | APITECH API Technologies Corp | APITECH | ||
CarbonCompositionMoldedOD/OFSeries(5Tol.)OASeries(10) | etc2List of Unclassifed Manufacturers etc2未分类制造商 | etc2 | ||
CMOSLOWCOST10-BITMULTIPLYINGDAC GENERALDESCRIPTION TheAD7533isalowcost,10-bit,4-quadrantmultiplyingDACmanufacturedusinganadvancedthin-film-on-monolithicCMOSwaferfabricationprocess. PinandfunctionequivalenttotheAD7520industrystandard,theAD7533isrecommendedasalowercostalternativeforoldAD752 | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | AD | ||
Low-CostPrecisionSensorSignalConditioner GeneralDescription TheMAX1452isahighlyintegratedanalog-sensorsignalprocessoroptimizedforindustrialandprocesscontrolapplicationsutilizingresistiveelementsensors.TheMAX1452providesamplification,calibration,andtemperaturecompensationthatenablesanoverallperformanceap | MaximMaximIntegrated 美信半导体 | Maxim | ||
DigitalCodingSchemesforMixedSignalCommunication OVERVIEW AnAnalog-to-Digital(A/D)convertertranslatesananaloginputsignalintoadiscretedigitalcode.Thisdigitalrepresentationofthe“realworld”signalcanbemanipulatedinthedigitaldomainforthepurposesofinformationprocessing,computing,datatransmissionorcontrolsystem | MicrochipMicrochip Technology Inc. 微芯科技微芯科技股份有限公司 | Microchip | ||
GLASSPACKAGESTEPRECOVERYDIODE DESCRIPTION: TheASRD700SeriesofStepRecoveryDiodesareDesignedforGeneralPurposeVCOandSamplerApplications. FEATURESINCLUDE: •TransitionTimeasLowas70pS •HermeticGlassPackage | ASI Advanced Semiconductor, Inc | ASI | ||
GLASSPACKAGESTEPRECOVERYDIODE DESCRIPTION: TheASRD700SeriesofStepRecoveryDiodesareDesignedforGeneralPurposeVCOandSamplerApplications. FEATURESINCLUDE: •TransitionTimeasLowas70pS •HermeticGlassPackage | ASI Advanced Semiconductor, Inc | ASI | ||
GLASSPACKAGESTEPRECOVERYDIODE DESCRIPTION: TheASRD700SeriesofStepRecoveryDiodesareDesignedforGeneralPurposeVCOandSamplerApplications. FEATURESINCLUDE: •TransitionTimeasLowas70pS •HermeticGlassPackage | ASI Advanced Semiconductor, Inc | ASI | ||
ZENERDIODECHIPS •1N746ATHRU1N759AAVAILABLEINJANHCANDJANKCPERMIL-PRF-19500/127 •1N4370ATHRU1N4372AAVAILABLEINJANHCANDJANKCPERMIL-PRF-19500/127 •ZENERDIODECHIPS •0.5WATTCAPABILITYWITHPROPERHEATSINKING •COMPATIBLEWITHALLWIREBONDINGDIEATTACHTECHNIQUES,WITHTHEEXCEPTIONOFS | CDI-DIODE Compensated Deuices Incorporated | CDI-DIODE | ||
LEADLESSPACKAGEFORSURFACEMOUNT •1N746AUR-1THRU1N759AUR-1AVAILABLEINJAN,JANTXANDJANTXVPERMIL-PRF-19500/127 •1N4370AUR-1THRU1N4372AUR-1AVAILABLEINJAN,JANTXANDJANTXVPERMIL-PRF-19500/127 •LEADLESSPACKAGEFORSURFACEMOUNT •METALLURGICALLYBONDED | CDI-DIODE Compensated Deuices Incorporated | CDI-DIODE | ||
SILICONZENERDIODES | CDIL CDIL | CDIL | ||
PNPSILICONPLANAREPITAXIALTRANSISTORS | CDIL CDIL | CDIL | ||
SmallSignalTransistorsPNP-HighCurrentTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize66x66MILS DieThickness7.1MILS BaseBondingPadArea7.9x7.9MILS Emitter1BondingPadArea7.9x9.5MILS Emitter2BondingPadArea7.9x9.5MILS TopSideMetalizationAl-Si-30,000Å BackSideMetalizatio | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
PIEZOBUZZERINDICATOR FEATURES •through-holetabs •threadedbody •12Vdcrating •3.6kHzratedfrequency •slowpulsetone | CUID CUI Devices | CUID |
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