FAST EFFICIENT PLASTIC RECTIFIER

FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Glass passivated chip junction ♦ Low leakage, high voltage ♦ High surge current capability ♦ Superfast recovery time, for high efficiency ♦ High temperature soldering in accordance with CECC 802 / Refl

文件：86.04 Kbytes 页数：2 Pages

GE

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

Power pack\nGlass passivated pellet chip junction\nUltrafast recovery time;

Vishay

威世科技