Ultrafast Plastic Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 s, per JESD 22-B10

文件：137.32 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for D2PAK (TO-263AB) package) • Solder dip 275 °C max. 10 s, per JE

文件：140.46 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Ultrafast Plastic Rectifier

Vishay

威世科技