Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry.

Features Incorporates standard JEDEC pitches and CSP solder ball diameters Compatible with standard SMT assembly and test techniques Utilizes cost-effective thin film redistribution technologies Backside laser mark compatible No need for underfill in most applications Full turnkey CSPn

文件：1.24294 Mbytes 页数：4 Pages

amkor

安靠科技

TAI-TECH ADVANCED ELECTRONICS

TAI-TECH ADVANCED ELECTRONICS

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FCM
QFP48

FCM

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FAIRCHILD/仙童
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ON/安森美
SMD

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