Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

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AMKOR

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a flip chip solution in a CSP package format.

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AMKOR

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Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format.

APPLICATIONS The fcCSP package is an attractive option for applications in which both performance and form factor are critical. Examples include high-performance mobile devices (including 5G), infotainment and ADAS for automotive and AI. Further, the benefits from low inductance and increased rou

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AMKOR

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TO-252

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