首页 >FCCSP>规格书列表

零件编号下载 订购功能描述/丝印制造商 上传企业LOGO

FCCSP

Silver Wirebonding

KEYFEATURES Ag-AlloywireissofterthanCuwireresultinginlowerAl-Splashandlowerriskofbondpaddamage Ag-Alloywirehasawideprocesswindowthatimprovesmanufacturabilityfordeviceswithfragilebondpadstructures

amkor

Amkor Technology

FCCSP

a flip chip solution in a CSP package format.

amkor

Amkor Technology

FCCSP_V01

Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format.

APPLICATIONS ThefcCSPpackageisanattractiveoptionforapplicationsinwhichbothperformanceandformfactorarecritical.Examplesincludehigh-performancemobiledevices(including5G),infotainmentandADASforautomotiveandAI.Further,thebenefitsfromlowinductanceandincreasedrou

amkor

Amkor Technology

详细参数

  • 型号:

    FCCSP

  • 制造商:

    AMKOR

  • 制造商全称:

    AMKOR

  • 功能描述:

    a flip chip solution in a CSP package format.

供应商型号品牌批号封装库存备注价格
AMKOR
23+
原厂原包
19960
只做进口原装 终端工厂免费送样
询价
24+
N/A
69000
一级代理-主营优势-实惠价格-不悔选择
询价
FC(方成)
24+
con
10000
查现货到京北通宇商城
询价
MORNSUN
1822+
DIP
9852
只做原装正品假一赔十为客户做到零风险!!
询价
MORNSUN/金升阳
2447
DIP
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
MORNSUN/金升阳
20+
DIP
50
就找我吧!--邀您体验愉快问购元件!
询价
MORNSUN
DIP
22+
6000
十年配单,只做原装
询价
MORNSUN/金升阳
23+
na
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
MORNSUN/金升阳
22+
DIP
2600
金升阳一级代理只做原装假一罚千价格优势
询价
MORNSUN
23+
2000
金升阳代理
询价
更多FCCSP供应商 更新时间2025-5-19 15:00:00