Surface Mount Chip Resistors

文件：196.62 Kbytes 页数：2 Pages

Panasonic

松下

3300-3670 MHz, 31 dB, 10.7 W Avg. AIRFAST POWER AMPLIFIER MODULE

Features • 2−stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier • Advanced high performance in−package Doherty • Thermal path is separated from electrical/solder connection path for enhanced thermal dissipation • Fully matched (50 ohm

文件：220.04 Kbytes 页数：17 Pages

恩XP

null3400–3600 MHz, 30 dB, 10.5 W Avg. AIRFAST POWER AMPLIFIER MODULE

Features • 2−stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier • Advanced high performance in−package Doherty • Thermal path is separated from electrical/solder connection path for enhanced thermal dissipation • Fully matched (50 ohm

文件：223.18 Kbytes 页数：17 Pages

恩XP

7-Bit 0.25dB Digital step Attenuator 150MHz to 5000MHz

FEATURES  Glitch-Free, 2kV HBM)  Serial & Parallel In

文件：2.47101 Mbytes 页数：19 Pages

RENESAS

瑞萨

3300-3670 MHz, 31 dB, 10.7 W Avg. AIRFAST POWER AMPLIFIER MODULE

Features • 2−stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier • Advanced high performance in−package Doherty • Thermal path is separated from electrical/solder connection path for enhanced thermal dissipation • Fully matched (50 ohm

文件：220.04 Kbytes 页数：17 Pages

恩XP

null3400–3600 MHz, 30 dB, 10.5 W Avg. AIRFAST POWER AMPLIFIER MODULE

Features • 2−stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier • Advanced high performance in−package Doherty • Thermal path is separated from electrical/solder connection path for enhanced thermal dissipation • Fully matched (50 ohm

文件：223.18 Kbytes 页数：17 Pages

恩XP

3300-3670 MHz, 31 dB, 10.7 W Avg. AIRFAST POWER AMPLIFIER MODULE

Features • 2−stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier • Advanced high performance in−package Doherty • Thermal path is separated from electrical/solder connection path for enhanced thermal dissipation • Fully matched (50 ohm

文件：220.04 Kbytes 页数：17 Pages

恩XP

null3400–3600 MHz, 30 dB, 10.5 W Avg. AIRFAST POWER AMPLIFIER MODULE

Features • 2−stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier • Advanced high performance in−package Doherty • Thermal path is separated from electrical/solder connection path for enhanced thermal dissipation • Fully matched (50 ohm

文件：223.18 Kbytes 页数：17 Pages

恩XP

SKY67021-396LF: 0.4 to 1.2 GHz High-Linearity, Active-Bias Low-Noise Amplifier

Applications GSM, CDMA, WCDMA, TD-SCDMA cellular infrastructure Ultra low-noise systems Balanced, single-ended low-noise amplifier designs Features Extended operating temperature range: –40 °C to +100 °C Low noise figure: 0.6 dB @ 0.9 GHz Excellent IIP3 performance: +22.5 dBm @ 0.9 GHz Gai

文件：2.45353 Mbytes 页数：17 Pages

SKYWORKS

思佳讯

SKY67022-396LF: 1.6 to 2.2 GHz High-Linearity, Active-Bias Low-Noise Amplifier

Applications  GSM, CDMA, WCDMA, TD-SCDMA cellular infrastructure  Ultra low-noise systems  Balanced, single-ended low-noise amplifier designs Features  Extended operating temperature range: –40 C to +100 C  Low noise figure: 0.65 dB @ 1.85 GHz  Excellent IIP3 performance: +21.3 dBm

文件：1.87899 Mbytes 页数：14 Pages

SKYWORKS

思佳讯