Single/Dual/Quad/Octal TDM-Over-Packet Chip

General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/

文件：803.77 Kbytes 页数：74 Pages

Maxim

美信

Single/Dual/Quad/Octal TDM-Over-Packet Chip

General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/

文件：803.77 Kbytes 页数：74 Pages

Maxim

美信

Single/Dual/Quad/Octal TDM-over-Packet Chip

文件：1.34346 Mbytes 页数：16 Pages

Maxim

美信

Single/Dual/Quad/Octal TDM-over-Packet Chip

文件：271.01 Kbytes 页数：16 Pages

Maxim

美信

Single/Dual/Quad/Octal TDM-over-Packet Chip

文件：1.34346 Mbytes 页数：16 Pages

Maxim

美信

Single/Dual/Quad/Octal TDM-over-Packet Chip

文件：271.01 Kbytes 页数：16 Pages

Maxim

美信

Package：484-BGA 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：集成电路（IC） 专用 IC 描述：IC TDM 484HSBGA

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亚德诺

Package：484-BGA 裸露焊盘；包装：托盘 类别：集成电路（IC） 专用 IC 描述：IC TDM 484HSBGA

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亚德诺