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HSC276A

SiliconSchottkyBarrierDiodeforMixer

Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign.

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

HSD276A

SiliconSchottkyBarrierDiodeforDetector

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

HSD276A

SiliconSchottkyBarrierDiodeforDetector

HitachiHitachi Semiconductor

日立日立公司

HSL276A

SiliconSchottkyBarrierDiodeforDetector

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

HSM276AS

SiliconSchottkyBarrierDiodeforBalancedMixer

Features •Highforwardcurrent,Lowcapacitance. •HSM276ASwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSM276AS

SiliconSchottkyBarrierDiodeforBalancedMixer

Features •Highforwardcurrent,Lowcapacitance. •HSM276ASwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

HSM276ASR

SiliconSchottkyBarrierDiodeforBalancedMixer

Features •Highforwardcurrent,Lowcapacitance. •HSM276ASRwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

HSM276ASR

SiliconSchottkyBarrierDiodeforBalancedMixer

Features •Highforwardcurrent,Lowcapacitance. •HSM276ASRwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSM276S

SiliconSchottkyBarrierDiodeforBalancedMixer

Features •Highforwardcurrent,Lowcapacitance. •HSM276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSM276S

SiliconSchottkyBarrierDiodeforBalancedMixer

Features •Highforwardcurrent,Lowcapacitance. •HSM276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞萨瑞萨科技有限公司

详细参数

  • 型号:

    DS276SN/T&R

  • 功能描述:

    RS-232接口集成电路

  • RoHS:

  • 制造商:

    Exar

  • 数据速率:

    52 Mbps

  • 工作电源电压:

    5 V

  • 电源电流:

    300 mA

  • 工作温度范围:

    - 40 C to + 85 C

  • 安装风格:

    SMD/SMT

  • 封装/箱体:

    LQFP-100

供应商型号品牌批号封装库存备注价格
MAXIM
23+
SOIC
8888
专做原装正品,假一罚百!
询价
DALLAS
23+
SOIC
65480
询价
DALLAS
2405+
原厂封装
12500
15年芯片行业经验/只供原装正品:0755-83267371邹小姐
询价
Maxim Integrated
24+
8-SOIC
65200
一级代理/放心采购
询价
MAXIM
20+
SOP-8
1001
就找我吧!--邀您体验愉快问购元件!
询价
Maxim
22+
8SOIC
9000
原厂渠道,现货配单
询价
MAXIM/美信
23+
NA
154
电子元器件供应原装现货. 优质独立分销。原厂核心渠道
询价
MAXIM/美信
22+
N/A
12245
现货,原厂原装假一罚十!
询价
MAXIM
23+
35500
询价
Maxim Integrated
23+
8-SOIC
7300
专注配单,只做原装进口现货
询价
更多DS276SN/T&R供应商 更新时间2025-7-19 17:00:00