DS250DF230ZLSR集成电路（IC）的专用规格书PDF中文资料

DS250DF230ZLSR属于集成电路（IC）的专用。由德州仪器制造生产的DS250DF230ZLSR专用该系列产品可提供所需的功能，用以将信息源/信宿连到各种复杂或范围狭窄应用中的传感器、变送器、致动器、传输介质或其他此类端点。例如，汽车安全气囊驱动器、车身控制和信息娱乐总线、自适应电缆均衡器、智能卡等等。

1 Features

• Dual-channel multi-rate retimer with integrated

signal conditioning

• All channels lock independently from 19.6 to

25.8 Gbps (including sub-rates, such as 12.16512

Gbps, 9.8304 Gbps, 6.144 Gbps, and more)

• Ultra-low latency: <500 ps Typical for 25.78125-

Gbps data rate

• Adaptive continuous time linear equalizer (CTLE)

• Continuous adaptive decision feedback equalizer

(DFE), capable of compensating large channel

loss variation over temperature

• Combined equalization supporting 35-dB channel

loss at 12.9 GHz

• On-chip eye-opening monitor (EOM), PRBS

pattern checker and generator

• Low-jitter transmitter with 3-Tap FIR filter

• Integrated 2×2 cross-point

• Recovered clock available for system clock

synchronization applications on channel 0

• Single power supply, no low-jitter reference clock

required

• Wide stay-in-lock temperature range

2 Applications

• Jitter cleaning for front-port optical interface in

wireless and wired systems

• Backplane/mid-plane reach extension

• Active cable assemblies

• 802.3bj 100GbE, InfiniBand EDR, and OIFCEI-

25G-LR/MR/SR/VSR electrical interfaces

• SFP28, QSFP28, CFP2/CFP4, CDFP

3 Description

The DS250DF230 is a dual-channel multi-rate retimer

with integrated signal conditioning. The device is used

to extend the reach and robustness of long, lossy,

crosstalk-impaired high-speed serial links and while

achieving a bit error rate (BER) of 10–15 or less.

Each channel of the DS250DF230 independently

locks to serial data rates in a continuous range from

19.6 Gbps to 25.8 Gbps or to any supported subrate

(÷2 and ÷4), including key data rates such as

12.16512 Gbps, 9.8304 Gbps, and 6.144 Gbps.

The DS250DF230 is offered in two package options,

36-pin NFBGA and 32-pin QFN, with compact body

sizes of 5 × 5 mm. The NFBGA (ZLS) package offers

robust performance and ease of design with minimal

BOM footprint, while the QFN (RTV) package offers

similar performance characteristics with improved

thermal performance supporting PCB temperatures

up to 105°C without the need for a heat sink.