首页 >DL-RAPPID564XASW>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Dual,HighSpeedECLComparators | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | AD | ||
GENERALPURPOSETRANSISTOR | HOTTECHGuangdong Hottech Co. Ltd. 合科泰深圳市合科泰电子有限公司 | HOTTECH | ||
EncoderLineDrivers | AVAGOAVAGO TECHNOLOGIES LIMITED 安华高 | AVAGO | ||
QuickAssemblyTwoandThreeChannelOpticalEncoders | HPAgilent(Hewlett-Packard) 安捷伦科技安捷伦科技有限公司 | HP | ||
GaAsPHEMTMMICLOWNOISEAMPLIFIER,7-13.5GHz | Hittite Hittite Microwave Corporation | Hittite | ||
GaAsPHEMTMMICLOWNOISEAMPLIFIER,7-13.5GHz GeneralDescription TheHMC564isahighdynamicrangeGaAsPHEMTMMICLowNoiseAmplifier(LNA)chipwhichoperatesfrom7to13.5GHz.TheHMC564featuresextremelyflatperformancecharacteristicsincluding17dBofsmallsignalgain,1.8dBofnoisefigureandoutputIP3of24dBmacrosst | Hittite Hittite Microwave Corporation | Hittite | ||
Point-to-Multi-PointRadios GeneralDescription TheHMC564isahighdynamicrangeGaAsPHEMTMMICLowNoiseAmplifier(LNA)chipwhichoperatesfrom7to13.5GHz.TheHMC564featuresextremelyflatperformancecharacteristicsincluding17dBofsmallsignalgain,1.8dBofnoisefigureandoutputIP3of24dBmacrosst | MICROSS Micross Components | MICROSS | ||
GaAsPHEMTMMICLOWNOISEAMPLIFIER GeneralDescription TheHMC564isahighdynamicrangeGaAsPHEMTMMICLowNoiseAmplifier(LNA)chipwhichoperatesfrom7to13.5GHz.TheHMC564featuresextremelyflatperformancecharacteristicsincluding17dBofsmallsignalgain,1.8dBofnoisefigureandoutputIP3of24dBmacrossthe | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | AD | ||
PNPEPITAXIALPLANARTRANSISTOR Description TheHSB564Aisdesignedforgeneralpurposelowfrequencypoweramplifierapplications. AbsoluteMaximumRatings •MaximumTemperatures StorageTemperature...........................................................-55~+150°C JunctionTemperature............... | HSMCHi-Sincerity Mocroelectronics 华昕华昕科技有限公司 | HSMC | ||
EPITAXIALPLANARPNPTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT) SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION. FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess. ●HighPackingDensity. | KECKEC CORPORATION KEC株式会社 | KEC |
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