D2PAK follows the JEDEC standard (TO-263) for high-power discrete products.

FEATURES Low on-resistance and high-current density due to thick Al wirebonding Full turnkey available from wafer saw through test and packing Green materials: Pb-free plating and halogen-free mold compound Applications D2PAK is suitable for high-power applications (over 100A available),

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D2PAK Case

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Central

2.00mm HEADERS & SHUNTS .079 [2.00] CENTERLINE

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2.00mm HEADERS & SHUNTS .079 [2.00] CENTERLINE

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SINGLE ROW PIN HEADER

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SINGLE ROW PIN HEADER

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SINGLE ROW PIN HEADER

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SINGLE ROW PIN HEADER

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2.00mm HEADERS & SHUNTS .079 [2.00] CENTERLINE

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DUAL ROW PIN HEADER

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