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CY7C1313KV18-333BZC集成电路(IC)的存储器规格书PDF中文资料

CY7C1313KV18-333BZC
厂商型号

CY7C1313KV18-333BZC

参数属性

CY7C1313KV18-333BZC 封装/外壳为165-LBGA;包装为托盘;类别为集成电路(IC)的存储器;产品描述:IC SRAM 18MBIT PARALLEL 165FBGA

功能描述

18-Mbit QDR짰 II SRAM Four-Word Burst Architecture

封装外壳

165-LBGA

文件大小

1.22429 Mbytes

页面数量

33

生产厂商 CypressSemiconductor
企业简称

CYPRESS赛普拉斯

中文名称

赛普拉斯半导体公司官网

原厂标识
CYPRESS
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-8-1 23:00:00

人工找货

CY7C1313KV18-333BZC价格和库存,欢迎联系客服免费人工找货

CY7C1313KV18-333BZC规格书详情

Functional Description

The CY7C1311KV18, CY7C1911KV18, CY7C1313KV18, and CY7C1315KV18 are 1.8 V Synchronous Pipelined SRAMs, equipped with QDR II architecture. QDR II architecture consists of two separate ports: the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR II architecture has separate data inputs and data outputs to completely eliminate the need to ‘turnaround’ the data bus that exists with common I/O devices.

特性 Features

■ Separate independent read and write data ports

❐ Supports concurrent transactions

■ 333-MHz clock for high bandwidth

■ Four-word burst for reducing address bus frequency

■ Double data rate (DDR) interfaces on both read and write ports (data transferred at 666 MHz) at 333 MHz

■ Two input clocks (K and K) for precise DDR timing

❐ SRAM uses rising edges only

■ Two Input Clocks for Output Data (C and C) to minimize Clock skew and flight time mismatches

■ Echo clocks (CQ and CQ) simplify data capture in high speed systems

■ Single multiplexed address input bus latches address inputs for read and write ports

■ Separate port selects for depth expansion

■ Synchronous internally self-timed writes

■ QDR® II operates with 1.5 cycle read latency when DOFF is asserted HIGH

■ Operates similar to QDR I device with 1 cycle read latency when DOFF is asserted LOW

■ Available in × 8, × 9, × 18, and × 36 configurations

■ Full data coherency, providing most current data

■ Core VDD = 1.8 V (±0.1 V); I/O VDDQ = 1.4 V to VDD

❐ Supports both 1.5 V and 1.8 V I/O supply

■ Available in 165-ball FBGA package (13 × 15 × 1.4 mm)

■ Offered in both Pb-free and non Pb-free packages

■ Variable drive HSTL output buffers

■ JTAG 1149.1 compatible test access port

■ PLL for accurate data placement

产品属性

  • 产品编号:

    CY7C1313KV18-333BZC

  • 制造商:

    Cypress Semiconductor Corp

  • 类别:

    集成电路(IC) > 存储器

  • 包装:

    托盘

  • 存储器类型:

    易失

  • 存储器格式:

    SRAM

  • 技术:

    SRAM - 同步,QDR II

  • 存储容量:

    18Mb(1M x 18)

  • 存储器接口:

    并联

  • 电压 - 供电:

    1.7V ~ 1.9V

  • 工作温度:

    0°C ~ 70°C(TA)

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    165-LBGA

  • 供应商器件封装:

    165-FBGA(13x15)

  • 描述:

    IC SRAM 18MBIT PARALLEL 165FBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
CYPRESS(赛普拉斯)
24+
LBGA165
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
CYPRESS
24+
BGA
30617
主打CYPRESS品牌价格绝对优势
询价
CYPRESS
22+
BGA
8000
原装正品支持实单
询价
Cypress
165-FBGA
7510
Cypress一级分销,原装原盒原包装!
询价
Infineon Technologies
23+/24+
165-LBGA
8600
只供原装进口公司现货+可订货
询价
Cypress Semiconductor Corp
23+
165-FBGA13x15
7300
专注配单,只做原装进口现货
询价
Cypress Semiconductor Corp
23+
165-FBGA13x15
7300
专注配单,只做原装进口现货
询价
Cypress
22+
165FBGA (13x15)
9000
原厂渠道,现货配单
询价
ADI
23+
BGA
7000
询价
Cypress Semiconductor Corp
25+
165-LBGA
9350
独立分销商 公司只做原装 诚心经营 免费试样正品保证
询价