丝印：96370M；Package：LSON-CLIP；Synchronous Buck NexFET™ Power Stage

1FEATURES • 90% System Efficiency at 25A • High Frequency Operation (Up To 2MHz) • Incorporates Power Block Technology • High Density – SON 5-mm × 6-mm Footprint • Low Power Loss 2.6W at 25A • Ultra Low Inductance Package • System Optimized PCB Footprint • 3.3V and 5V PWM Signal Compat

文件：924.79 Kbytes 页数：19 Pages

TI

德州仪器

Synchronous Buck NexFET??Power Stage

文件：1.00452 Mbytes 页数：19 Pages

TI

德州仪器

Synchronous Buck NexFET??Power Stage

文件：1.00452 Mbytes 页数：19 Pages

TI

德州仪器

Synchronous Buck NexFET??Power Stage

文件：950.34 Kbytes 页数：18 Pages

TI

德州仪器

丝印：96370M；Package：LSON-CLIP；Synchronous Buck NexFET™ Power Stage

1FEATURES • 90% System Efficiency at 25A • High Frequency Operation (Up To 2MHz) • Incorporates Power Block Technology • High Density – SON 5-mm × 6-mm Footprint • Low Power Loss 2.6W at 25A • Ultra Low Inductance Package • System Optimized PCB Footprint • 3.3V and 5V PWM Signal Compat

文件：924.79 Kbytes 页数：19 Pages

TI

德州仪器

Synchronous Buck NexFET??Power Stage

文件：1.00452 Mbytes 页数：19 Pages

TI

德州仪器

Synchronous Buck NexFET??Power Stage

文件：1.33876 Mbytes 页数：20 Pages

TI

德州仪器

高频同步降压 NexFET™ 功率级

The CSD96370Q5M NexFET Power Stage is an optimized design for use in a high power, high density Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology to complete the power stage switching function. This combination produces a high current, high eff • 90% System Efficiency at 25A\n• High Frequency Operation (Up To 2MHz)\n• Incorporates Power Block Technology \n• High Density – SON 5-mm × 6-mm Footprint\n• Low Power Loss 2.6W at 25A\n• Ultra Low Inductance Package\n• System Optimized PCB Footprint\n• 3.3V and 5V PWM Signal Compatible\n• 3-St;

TI

德州仪器

Package：22-PowerLFDFN；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：集成电路（IC） 全半桥驱动器 描述：IC SYNC BUCK NEXFET 22SON

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德州仪器