Single-Chip 1k and 2k CMOS Microcontrollers

文件：339.21 Kbytes 页数：24 Pages

NSCNational Semiconductor (TI)

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Single-Chip 1k and 2k CMOS Microcontrollers

TI

德州仪器

Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.65 x 21.65 MILS Die Thickness 9.0 MILS Gate Bonding Pad Area 5.5 x 5.5 MILS Source Bonding Pad Area 5.9 x 13.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 12,000Å

文件：200.18 Kbytes 页数：2 Pages

Central

N- Channel Enhancement-Mode Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.6 x 21.6 MILS Die Thickness 5.9 MILS Gate Bonding Pad Area 5.5 x 5.5 MILS Source Bonding Pad Area 5.9 x 13.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 12,000Å

文件：412.12 Kbytes 页数：2 Pages

Central

GERMANIUM PNP TRANSISTORS

文件：2.44311 Mbytes 页数：6 Pages

ETC1List of Unclassifed Manufacturers

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