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CC1352R

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

文件:2.9638 Mbytes 页数:72 Pages

TI

德州仪器

CC1352R

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

文件:1.75855 Mbytes 页数:54 Pages

TI

德州仪器

CC1352R

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.63739 Mbytes 页数:69 Pages

TI

德州仪器

CC1352R

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.65151 Mbytes 页数:72 Pages

TI

德州仪器

CC1352R

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

文件:2.21766 Mbytes 页数:63 Pages

TI

德州仪器

CC1352R

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.59194 Mbytes 页数:91 Pages

TI

德州仪器

CC1352R

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件:3.42691 Mbytes 页数:75 Pages

TI

德州仪器

CC1352R

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:3.50774 Mbytes 页数:64 Pages

TI

德州仪器

CC1352R

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:2.60305 Mbytes 页数:59 Pages

TI

德州仪器

CC1352R

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件:3.96385 Mbytes 页数:75 Pages

TI

德州仪器

技术参数

  • RAM (KB):

    80

  • Type:

    Wireless MCU

  • Features:

    Bluetooth mesh

  • GPIO:

    28

  • Peripherals:

    2 SPI

  • Security:

    Device identity

  • Sensitivity (best) (dBm):

    -121

  • Operating temperature range (C):

    -40 to 105

  • Rating:

    Catalog

供应商型号品牌批号封装库存备注价格
TI
24+
SO|16
70230
免费送样原盒原包现货一手渠道联系
询价
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
询价
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
询价
Texas Instruments
20+
VQFN-48
29860
TI微控制器MCU-可开原型号增税票
询价
TI(德州仪器)
2447
VQFN-48(7x7)
315000
2500个/圆盘一级代理专营品牌!原装正品,优势现货,
询价
TI(德州仪器)
2021+
VQFN-48(7x7)
499
询价
NA
23+
NA
26094
10年以上分销经验原装进口正品,做服务型企业
询价
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
询价
TI
23+
QFN
50000
全新原装正品现货,支持订货
询价
TI(德州仪器)
2021+
8000
原装现货,欢迎询价
询价
更多CC1352R供应商 更新时间2025-10-4 15:14:00