C1608C0G1E103J电容器的陶瓷电容器规格书PDF中文资料

C1608C0G1E103J属于电容器的陶瓷电容器。由东电化（中国）投资有限公司制造生产的C1608C0G1E103J陶瓷电容器电容器是存储电荷的无源电子器件。陶瓷电容器包括两个或更多个交替的陶瓷材料层（作为电介质）和金属层（用作非极化电极）。应用范围包括汽车、旁路、去耦、滤波、射频、ESD 保护。通孔版本通常为圆片或液滴形状，带有两条引线。

MULTILAYER CERAMIC CHIP CAPACITORS

Commercial grade, MEGACAP type

SERIES OVERVIEW

TDK multilayer ceramic chip capacitor CKG series is a product which metal frames are connected to terminations of MLCC, and it is also called MEGACAP. MEGACAP has higher mechanical endurance by the flexible metal frame structure which absorbs thermal and mechanical stress. Also the stacked type is effective in mounting area reduction because twice capacitance is realized by double-stacked structure without changing footprint.

■ FEATURES

• Higher mechanical endurance is realized by metal frame structure.

• Twice capacitance is realized by double-stacked structure without changing footprint.

• Lower ESR and ESL than Al caps.

• C0G temperature characteristic which has excellent stable temperature and DC-bias characteristcs is applicable.

• Mounting on Al board is applicable.

■ APPLICATIONS

• Smoothing circuits

• DC-DC converters, inverters, battery chargers

• The places where Al electrolytic or Film capacitor is not suitable because of higher ESR/ESL, heat resistivity, or its size.

• Areas where electrolytic capacitors or film capacitors cannot be placed due to high temperatures (e.g., IGBT) around them.

• The C0G temperature characteristic is suitable for the high-reliability circuits such as time constant, filter, resonance, oscillation and snubber circuits.