INTENSI-FI® XLR 2 × 2 IEEE 802.11N 2.4-GHZ 5-GHZ ROUTER SOC

• High-performance low-cost Draft-802.11n compliant Systemon- a-Chip (SoC) CPU/MAC/baseband/radio wireless router solution • Optimized Intensi-fi® XLR platform with Accelerange™ Technology—a unique set of hardware and software enhancements that ensure more robust wireless coverage in the far

文件：124.59 Kbytes 页数：2 Pages

BOARDCOM

博通

Intensi-fi® XLR 802.11n (2.4/5 GHz) Wireless Set-Top Box System on Chip

Provides 802.11n dual-band (2.4 GHz/5 GHz) capabilities in a small package for set-top boxes, where compact form factors are important.It also integrates a high-performance 300 MHz CPU architecture and offers options for Fast Ethernet and Gigabit Ethernet PHYs. The BCM4717V provides a superior MIMO ·Primary operation on the 5 Ghz band to allow greatest frequency agility\n·2.4 Ghz is also supported for communication with Not Recommended for New Design devices\n·MII/GMII connection to the IPTV host SoC such as BCM7405 Automatic detection of multimedia streams to enable quality of service process;

Broadcom

博通

SILICON EPITAXIAL PLANAR ZENER DIODES

文件：292.48 Kbytes 页数：4 Pages

SEMTECH_ELEC

先之科半导体

ZENER DIODE CHIPS

• ZENER DIODE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N4678 THRU 1N4717 • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • 50µA, LOW OPERATING CURRENT, ZENER DIODES • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEP

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CDI-DIODE

50 uA, LOW OPERATING CURRENT, ZENER DIODES

• 50µA, LOW OPERATING CURRENT, ZENER DIODES • LEADLESS PACKAGE FOR SURFACE MOUNT • DOUBLE PLUG CONSTRUCTION • METALLURGICALLY BONDED

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CDI-DIODE