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BPR550G

3Wto50WPLANARSHOCK/VIBRATIONPROOFHIGHPOWERRESISTORS

Features………………………………………………………… ◾Non-Inductiveplanarpackage ◾Highpowerdensity. ◾ThinpackageforhighdensityPCBinstallation. ◾Powerdissipatedabovetheboard. ◾RoHScompliant. ◾Superiorvibrationdurability Applications……………………………………………………… ◾Idealforextrememechanicallyst

BITECHBi technologies

瑞谷拜特上海瑞谷拜特软件技术有限公司

BPR550J

3Wto50WPLANARSHOCK/VIBRATIONPROOFHIGHPOWERRESISTORS

Features………………………………………………………… ◾Non-Inductiveplanarpackage ◾Highpowerdensity. ◾ThinpackageforhighdensityPCBinstallation. ◾Powerdissipatedabovetheboard. ◾RoHScompliant. ◾Superiorvibrationdurability Applications……………………………………………………… ◾Idealforextrememechanicallyst

BITECHBi technologies

瑞谷拜特上海瑞谷拜特软件技术有限公司

BRUS550

ULTRA-FASTRECOVERY4to6AMPERESSINGLE-PHASE,FULL-WAVEBRIDGESHEATSINKCHASSISPCBOARDMOUNTING

edi

Electronic devices inc.

BSP550

MiniPROFET(High-sideswitchShort-circuitprotectionInputprotectionOvertemperatureprotectionwithhysteresis)

MiniPROFET •High-sideswitch •Short-circuitprotection •Inputprotection •Overtemperatureprotectionwithhysteresis •Overloadprotection •Overvoltageprotection •Switchinginductiveload •Clampofnegativeoutputvoltagewithinductiveloads •Undervoltageshutd

SIEMENSSiemens Semiconductor Group

西门子德国西门子股份公司

BSP550

MiniPROFET(High-sideswitchShort-circuitprotectionInputprotectionOvertemperatureprotectionwithhysteresis)

MiniPROFET •High-sideswitch •Short-circuitprotection •Inputprotection •Overtemperatureprotectionwithhysteresis •Overloadprotection •Overvoltageprotection •Switchinginductiveload •Clampofnegativeoutputvoltagewithinductiveloads •Undervoltageshutd

InfineonInfineon Technologies AG

英飞凌英飞凌科技股份公司

BTS550

SmartHighsideHighCurrentPowerSwitch

InfineonInfineon Technologies AG

英飞凌英飞凌科技股份公司

BTS550P

SmartHighsideHighCurrentPowerSwitch(OverloadprotectionCurrentlimitationShortcircuitprotectionOvertemperatureprotection)

GeneralDescription NchannelverticalpowerFETwithchargepump,currentcontrolledinputanddiagnosticfeedbackwithloadcurrentsense,integratedinSmartSIPMOS®chiponchiptechnology.Fullyprotectedbyembeddedprotectionfunctions. Features •Overloadprotection •Currentl

SIEMENSSiemens Semiconductor Group

西门子德国西门子股份公司

BTS550P

SmartHighsideHighCurrentPowerSwitch

GeneralDescription NchannelverticalpowerFETwithchargepump,currentcontrolledinputanddiagnosticfeedbackwithloadcurrentsense,integratedinSmartSIPMOS®chiponchiptechnology.Providingembeddedprotectivefunctions. Features •Overloadprotection •Currentlimitation

InfineonInfineon Technologies AG

英飞凌英飞凌科技股份公司

BUF550

iscSiliconNPNPowerTransistors

DESCRIPTION ·Collector-EmitterBreakdownVoltage- :V(BR)CEO=10V(Min.) ·Noisefigure(NFTyp)=1.8dB ·9GHzfTsilicontechnology APPLICATIONS ·Designedforlowfrequencypoweramplifierapplications.

ISCInchange Semiconductor Company Limited

无锡固电无锡固电半导体股份有限公司

BY550

SILICONRECTIFIERDIODES

FEATURES: *Highcurrentcapability *Highsurgecurrentcapability *Highreliability *Lowreversecurrent *Lowforwardvoltagedrop

EIC

EIC discrete Semiconductors

产品属性

  • 产品编号:

    BC550CBU

  • 制造商:

    onsemi

  • 类别:

    分立半导体产品 > 晶体管 - 双极性晶体管(BJT)- 单个

  • 包装:

    卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带

  • 晶体管类型:

    NPN

  • 不同 Ib、Ic 时 Vce 饱和压降(最大值):

    600mV @ 5mA,100mA

  • 电流 - 集电极截止(最大值):

    15nA(ICBO)

  • 不同 Ic、Vce 时 DC 电流增益 (hFE)(最小值):

    420 @ 2mA,5V

  • 频率 - 跃迁:

    300MHz

  • 工作温度:

    150°C(TJ)

  • 安装类型:

    通孔

  • 封装/外壳:

    TO-226-3,TO-92-3 标准主体(!--TO-226AA)

  • 供应商器件封装:

    TO-92-3

  • 描述:

    TRANS NPN 45V 0.1A TO92-3

供应商型号品牌批号封装库存备注价格
FAIRCHILD
1907+
NA
30000
20年老字号,原装优势长期供货
询价
onsemi(安森美)
24+
TO-92-3
1612
原厂订货渠道,支持BOM配单一站式服务
询价
FairchildSemiconductor
24+
NA
3000
进口原装正品优势供应
询价
Fairchild
16+
原厂封装
10000
全新原装正品,代理优势渠道供应,欢迎来电咨询
询价
安森美
21+
12588
原装现货,价格优势
询价
原厂
2020+
7584
百分百原装正品 真实公司现货库存 本公司只做原装 可
询价
三年内
1983
只做原装正品
询价
FSC/ON
23+
原包装原封 □□
7584
原装进口特价供应 特价,原装元器件供应,支持开发样品 更多详细咨询 库存
询价
ON
20+
SMD
11520
特价全新原装公司现货
询价
Fairchild
1930+
N/A
6267
加我qq或微信,了解更多详细信息,体验一站式购物
询价
更多BC550CBU供应商 更新时间2025-7-20 19:20:00