首页 >AT2501T>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
50AMPLATCHINGPOWERRELAY | AZETTLERAmerican Zettler, Inc. 美国赛特勒 | AZETTLER | ||
60AMPLATCHINGPOWERRELAY | AZETTLERAmerican Zettler, Inc. 美国赛特勒 | AZETTLER | ||
25AMPSOZADIODECELLS | DEC DIOTEC Electronics Corporation | DEC | ||
25ABOSCHTYPEPRESS-FITDIODE Features ●DiffusedJunction ●LowLeakage ●LowCost ●HighSurgeCurrentCapability ●TypicalIRlessthan5.0µA | WTEWon-Top Electronics 毅星電子毅星电子股份有限公司 | WTE | ||
25ABOSCHTYPEPRESS-FITDIODE | WTEWon-Top Electronics 毅星電子毅星电子股份有限公司 | WTE | ||
25ABOSCHTYPEPRESS-FITDIODE | WTEWon-Top Electronics 毅星電子毅星电子股份有限公司 | WTE | ||
25AGLASSPASSIVATEDBOSCHTYPEPRESS-FITDIODE GlassPassivatedDieConstruction LowLeakage LowCost HighSurgeCurrentCapability TypicalIRlessthan5.0μA | WTEWon-Top Electronics 毅星電子毅星电子股份有限公司 | WTE | ||
SILICONBRIDGERECTIFIERS FEATURES: *Highcurrentcapability *Highsurgecurrentcapability *Highreliability *Lowreversecurrent *Lowforwardvoltagedrop *Pb/RoHSFree | EIC EIC discrete Semiconductors | EIC | ||
SILICONBRIDGERECTIFIERS | HY HY ELECTRONIC CORP. | HY | ||
SILICONBRIDGERECTIFIERS FEATURES ◇Ratingto1000VPRV ◇Surgeoverloadratingto300Amperespeak ◇Idealforprintedcircuitboard ◇Reliablelowcostconstructionutilizingmoldedplastictechniqueresultsininexpensiveproduct ◇LeadsolderableperMIL-STD-202method208 ◇Mounting:thruholefor#8screwmou | BILINGalaxy Semi-Conductor Holdings Limited 银河微电常州银河世纪微电子股份有限公司 | BILIN |
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