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AM81720-012中文资料意法半导体数据手册PDF规格书
AM81720-012规格书详情
DESCRIPTION
The AM81720-012 is designed specifically for Telecommunications applications.
The device is capable of withstanding any mismatch load condition at any phase angle (VSWR ∞:1) under full rated conditions. The unit is an overlay, emitter site ballasted, geometry utilizing a refractory/gold metallization system.
The unique AMPAC™ devices are housed in Hermetic Metal/Ceramic packages with internal Input/Output matching structures.
■ REFRACTORY/GOLD METALLIZATION
■ EMITTER SITE BALLASTED
■ RUGGIZED VSWR ∞:1
■ LOW THERMAL RESISTANCE
■ INPUT/OUTPUT MATCHING
■ OVERLAY GEOMETRY
■ METAL/CERAMIC HERMETIC PACKAGE
■ POUT = 12 W MIN. WITH 7.4 dB GAIN
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
AMD |
23+ |
CDIP24 |
154 |
全新原装正品现货,支持订货 |
询价 | ||
22+ |
5000 |
询价 | |||||
amd |
24+ |
N/A |
6980 |
原装现货,可开13%税票 |
询价 | ||
AMD |
21+ |
CDIP24 |
154 |
原装现货假一赔十 |
询价 | ||
AMD |
三年内 |
1983 |
只做原装正品 |
询价 | |||
AMD |
24+ |
NA/ |
60 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
询价 | ||
AMD |
23+ |
CDIP |
6500 |
全新原装假一赔十 |
询价 | ||
amd |
2023+ |
原厂封装 |
50000 |
原装现货 |
询价 | ||
AMD |
2016+ |
DIP24 |
6523 |
只做原装正品现货!或订货! |
询价 | ||
AMD |
23+ |
DIP-24 |
5000 |
专注配单,只做原装进口现货 |
询价 |
