ACEPACK 2 power module, 3-level topology, 1200 V, 100 A based on SiC Power MOSFET

DCFeatures • ACEPACK 2 power module – 13 mΩ of typical RDS(on) each switch (2 dice in parallel per switch) – 2.5 kVrms insulation voltage – Integrated NTC temperature sensor – DC link capacitors between DC BUS and neutral – AIN DBC improved thermal performance – Press fit contact pins De

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STMICROELECTRONICS

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ACEPACK 2 power module, 3-level topology, 1200 V, 100 A based on SiC Power MOSFET

This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal perform • ACEPACK 2 power module \n •13 mΩ of typical RDS(on) each switch (2 dice in parallel per switch) \n •2.5 kVrms insulation voltage \n •Integrated NTC temperature sensor \n •DC link capacitors between DC BUS and neutral \n •AIN DBC improved thermal performance \n •Press fit contact pins;

ST

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