2821755-2中文资料泰科电子数据手册PDF规格书

特性 Features

• 0.6mm pitch SMT connector design

includes robust metal housing

• 12G and 25G high speed, low-loss

33AWG cable

• Vertical, right angle and card edge

configurations with active latch

• Supports 85 and 100 ohm impedance

applications

• Flexible pinout arrangement allows for

mix of differential signal pairs and low

speed single-ended sidebands

• Flexible mounting and mating

arrangements:

• Cabled interconnects

• Card edge interconnects

• Vertical to right-angle, vertical

to straight, right-angle to rightangle, and right-angle to straight

receptacle-to-plug mating

• Platform developed to be scalable in

x4/x8 increments

• Sliver: 24p (x4), 50p (x8)

• Sliver for SFF-TA-1002: 28p (x4), 56p

(x8)

• Supports present and future bandwidth

needs without requiring requalification

and redesign

Applications

• Internal Cabled Solutions

• Chip to Chip

• Chip to I/O

• Chip to Backplane

• Board to Board

• PCB Card Edge (BTB) solutions

• Supports Ethernet, PCIe, SAS, SATA,

InfiniBand, and other custom protocols