首页 >0240C>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -AEC-Q101Qualified&PPAP. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features IO=200mA VR=40V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Termin | ANACHIPAnachip Corp 易亨电子易亨电子股份有限公司 | ANACHIP | ||
WirewoundResistors,IndustrialPower,SiliconeCoated,AdjustableEdgewoundTubular | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
WirewoundResistors,IndustrialPower,VitreousCoated | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
BLP0240 BLP0240 | BellingSHANGHAI BELLING CO., LTD. 上海贝岭上海贝岭股份有限公司 | Belling | ||
BridgeluxLSArraySeries Features •Compacthighfluxdensitylightsource •Uniformhighqualityillumination •Streamlinedthermalpath •EnergyStar/ANSIcompliantbinningstructure •Moreenergyefficientthanincandescent,halogenandfluorescentlamps •LowvoltageDCoperation •Instantlightwithunlimite | Bridgelux Bridgelux Inc | Bridgelux | ||
ApprovalProductSpecification GeneralDescription: DrivingMode:ActiveMatrix. ColorMode:FullColor(262Kcolor) DriverIC:S6E63D6,COGAssembly Interface: 1.MPUi80-system18-/16-/9-/8-bitbusinterface 2.MPUi68-system18-/16-/9-/8-bitbusinterface 3.Serialdatatransferinterface(SPI) | AZDISPLAYS AZ Displays | AZDISPLAYS | ||
ApprovalProductSpecification Purpose: ThisdocumentationdefinesgeneralproductspecificationforOLEDmodulesuppliedbyCMEL.Theinformationdescribedinthistechnicalspecificationistentative.PleaseContactCMEL’srepresentativewhileyourproductismodified. GeneralDescription: ■DrivingMode:ActiveMatrix. ■ | AZDISPLAYS AZ Displays | AZDISPLAYS | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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