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WED3C7410E16M450BM中文资料PDF规格书

WED3C7410E16M450BM
厂商型号

WED3C7410E16M450BM

功能描述

RISC Microprocessor Multichip Package

文件大小

485.69 Kbytes

页面数量

13

生产厂商 White Electronic Designs Corporation
企业简称

WEDC

中文名称

Microsemi Corporation(上海)官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-6-8 22:59:00

WED3C7410E16M450BM规格书详情

OVERVIEW

The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBX multichip package consists of:

■ 7410E AltiVec™ RISC processor

■ Dedicated 2MB SSRAM L2 cache, confi gured as 256Kx72

■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

■ Maximum Core frequency = 400, 450MHz

■ Maximum L2 Cache frequency = 200MHz

■ Maximum 60x Bus frequency = 133MHz**

FEATURES

■ Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX

■ Implementation of Altivec™ technology instruction set

■ Optional, high-bandwidth MPX bus interface

产品属性

  • 型号:

    WED3C7410E16M450BM

  • 制造商:

    WEDC

  • 制造商全称:

    White Electronic Designs Corporation

  • 功能描述:

    RISC Microprocessor Multichip Package

供应商 型号 品牌 批号 封装 库存 备注 价格
Microsemi(美高森美)
23+
CBGA255
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
WEDC
23+
NA/
3268
原装现货,当天可交货,原型号开票
询价
WEDC
19+
BGA
35210
原装现货/放心购买
询价
WEDC
QQ咨询
BGA
66
全新原装 研究所指定供货商
询价
23+
BGA
9800
现货库存,全新原装,特价销售
询价
MSC
18+
N/A
85600
保证进口原装可开17%增值税发票
询价
微芯/美高森美
22+
NA
500000
万三科技,秉承原装,购芯无忧
询价
WEDC
2021+
20
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
WEDC
23+
NA
66800
专注军工诚信经营原装正品
询价
WED
23+
BGA
1733
专业优势供应
询价