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UM2104A

包装:卷带(TR) 封装/外壳:轴向 类别:分立半导体产品 二极管 - 射频 描述:SI PPIN HERMETIC SEAL

MicrochipMicrochip Technology Inc.

微芯科技微芯科技股份有限公司

2104

PhenolicBoxWithCover

POMONA

Pomona Electronics

2104

3M??Scotchcast??ElectricalInsulatingResin2104

3MMinnesota Mining and Manufacturing

明尼苏达矿务明尼苏达矿务及制造业公司

2104A

Fieldbus,12Pr#18StrTC,XLPOIns,IS/OS,TPEJkt,CMG

BELDEN

Belden Inc.

2104-RC

HighCurrentToroidInductors

BournsBourns Inc.

伯恩斯(邦士)

2104-RC

HighCurrentToroidInductors

BournsBourns Inc.

伯恩斯(邦士)

2104-RC

HighCurrentToroidInductors

BournsBourns Inc.

伯恩斯(邦士)

2104-RC

HighCurrentToroidInductors

BournsBourns Inc.

伯恩斯(邦士)

ADSP-2104

LowCostDSPMicrocomputers

GENERALDESCRIPTION TheADSP-2104andADSP-2109processorsaresingle-chipmicrocomputersoptimizedfordigitalsignalprocessing(DSP)andotherhighspeednumericprocessingapplications.TheADSP-2104/ADSP-2109processorsarebuiltuponacommoncore.EachprocessorcombinesthecoreDSParchi

ADAnalog Devices

亚德诺亚德诺半导体技术有限公司

AG2104

MOSFET/IGBTGATEDRIVERHALF-BRIDGEDRIVER

DESCRIPTION TheAG2104isahighvoltage,highspeedpowerMOSFETandIGBTdriverbasedonP_SUBP_EPIprocess.ThefloatingchanneldrivercanbeusedtodrivetwoN-channelpowerMOSFETorIGBTinahalf-bridgeconfigurationwhichoperatesupto600V.LogicinputsarecompatiblewithstandardC

AITSEMIAiT Semiconductor Inc.

AiT創瑞科技

AGN2104H

HighSensitivity,with100mWnominaloperatingpower,inacompactandspacesavingcase

FEATURES 1.Compactslimbodysavesspace Thankstothesmallsurfaceareaof5.7mm×10.6mm.224inch×.417inchandlowheightof9.0mm.354inch,thepackagingdensitycanbeincreasedtoallowformuchsmallerdesigns. 2.Highsensitivitysinglesidestable type(Nominaloperatin

PanasonicPanasonic Corporation

松下松下电器

AGN2104H

ULTRA-SMALLPACKAGESLIMPOLARIZEDRELAY

FEATURES •Compactslimbodysavesspace Thankstothesmallsurfaceareaof5.7mm×10.6mm.224inch×.417inchandlowheightof9.0mm.354inch,thepackagingdensitycanbeincreasedtoallowformuchsmallerdesigns. •Outstandingsurgeresistance. Surgewithstandbetweenopencontac

NAISPanasonic electrical machinery (China) Co. , Ltd.

松下电器松下电器机电(中国)有限公司

AGN2104HZ

ULTRA-SMALLPACKAGESLIMPOLARIZEDRELAY

FEATURES •Compactslimbodysavesspace Thankstothesmallsurfaceareaof5.7mm×10.6mm.224inch×.417inchandlowheightof9.0mm.354inch,thepackagingdensitycanbeincreasedtoallowformuchsmallerdesigns. •Outstandingsurgeresistance. Surgewithstandbetweenopencontac

NAISPanasonic electrical machinery (China) Co. , Ltd.

松下电器松下电器机电(中国)有限公司

AGQ2104H

ULTRA-SMALLPACKAGEFLATPOLARIZEDRELAY

NAISPanasonic electrical machinery (China) Co. , Ltd.

松下电器松下电器机电(中国)有限公司

AGQ2104H

Highcapacity2Amp,FlatandCompactpackageTelephoneswitchboard

FEATURES 1.Highcapacity:2A 2.CompactflatbodysavesspaceWithasmallfootprintof 10.6mm(L)×7.2mm(W).417inch(L)×.283inch(W)forspacesavings, italsohasaveryshortheightof5.2mm.205inch.(StandardPCboardtype.) 3.Highsensitivitysinglesidestabletyp

PanasonicPanasonic Corporation

松下松下电器

aIVR2104

tandardCMOSprocess

APLUSAPLUS

APLUS

AIVR2104

StandardCMOSprocess.

APLUSAPLUS

APLUS

AN2104

UsingBackgroundDebugModefortheM68HC12Family

Introduction Thisapplicationnotedescribesthebasicoperationofthebackgrounddebugmode(BDM)andsomeofitsapplications,asitrelatestoMotorola’sM68HC12Familyofmicrocontrollers(MCU).ExamplesofincircuitprogrammingofinternalFLASHmemoryandin-circuitdebugging,usingP&

freescaleFreescaleiscreatingasmarter

飞思卡尔

ASX2104H

HIGHSENSITIVITYRELAYWITHGUARANTEEDLOWLEVELSWITCHINGCAPACITY

NAISPanasonic electrical machinery (China) Co. , Ltd.

松下电器松下电器机电(中国)有限公司

B2104

BROADBANDxDSL,HPN,CMCs

BROADBANDACCESS:xDSL,HPN,CMCs Broadbandhascomealongwayinthepastfewyears.Pulsecontinuestoleadthewaywithabroadrangeofcomponentsthatenabletwisted-paircopper,fiberandcoaxialcabletodeliverhigh-speedservicestohomesandbusinesses.Pulsecomponentsarealsous

pulse

Pulse Electronics

产品属性

  • 产品编号:

    UM2104A

  • 制造商:

    Microchip Technology

  • 类别:

    分立半导体产品 > 二极管 - 射频

  • 包装:

    卷带(TR)

  • 二极管类型:

    PIN - 单

  • 电压 - 峰值反向(最大值):

    400V

  • 不同 Vr、F 时电容:

    2.5pF @ 100V,1MHz

  • 不同 If、F 时电阻:

    2 欧姆 @ 100mA,2MHz

  • 工作温度:

    -65°C ~ 175°C

  • 封装/外壳:

    轴向

  • 供应商器件封装:

    轴向

  • 描述:

    SI PPIN HERMETIC SEAL

供应商型号品牌批号封装库存备注价格
Microchip
21+
15000
只做原装
询价
microchipdirect
23+
15422
原包装原标现货,假一罚十,
询价
MICROCHIP
22+
0
7
只做原装,有挂就有货。
询价
Microchip
7
只做正品
询价
UMEC
22+
DIP
90000
全新原装正品/价格优势
询价
UMEC
2022+
DIP
39356
全新原装正品
询价
UMEC
2021+
DIP
11000
十年专营原装现货,假一赔十
询价
UMEC
20+
DIP
52628
进口原装现货/价格优势
询价
UMEC-环球微
24+25+/26+27+
车规-电源模块
3280
一一有问必回一特殊渠道一有长期订货一备货HK仓库
询价
UMEC
23+
DIP
300
只做原装正品现货!或订货假一赔十!
询价
更多UM2104A供应商 更新时间2024-5-25 14:36:00