首页 >TNY276GN-TL>规格书列表
| 零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
|---|---|---|---|---|
SiliconSchottkyBarrierDiode Features •Highforwardcurrent,Lowcapacitance. •HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | KEXINGUANGDONG KEXIN INDUSTRIAL CO.,LTD 科信电子广东科信实业有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •Highforwardcurrent,Lowcapacitance. •CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SILICONSCHOTTKYBARRIERDIODEFORHIGHSPEEDSWITCHING Features •Highforwardcurrent,Lowcapacitance. •CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforDetectorandMixer Features •Highforwardcurrent,Lowcapacitance. •HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiode Features ●Highforwardcurrent,Lowcapacitance. ●HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ●CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | KEXINGUANGDONG KEXIN INDUSTRIAL CO.,LTD 科信电子广东科信实业有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforMixer Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
HSC276_03 | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiode Features ●Highforwardcurrent,Lowcapacitance. ●UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | KEXINGUANGDONG KEXIN INDUSTRIAL CO.,LTD 科信电子广东科信实业有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforMixer Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforMixer Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforDetector | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforDetector | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforDetector | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276ASwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276ASwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276ASRwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276ASRwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiode Features ●Highforwardcurrent,Lowcapacitance. ●HSM276ASRwhichisinterconnectedinseriesconfiguration isdesignedforbalancedmixeruse. ●MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | KEXINGUANGDONG KEXIN INDUSTRIAL CO.,LTD 科信电子广东科信实业有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS |
产品属性
- 产品编号：
TNY276GN-TL
- 制造商：
Power Integrations
- 类别：
集成电路（IC） > AC DC 转换器，离线开关
- 系列：
TinySwitch®-III
- 包装：
管件
- 输出隔离：
隔离
- 内部开关：
是
- 电压 - 击穿：
700V
- 拓扑：
反激
- 占空比：
65%
- 频率 - 开关：
132kHz
- 故障保护：
限流，开环，超温，过压，短路
- 控制特性：
EN
- 工作温度：
-40°C ~ 150°C（TJ）
- 封装/外壳：
8-SMD（7 个接脚），鸥翼
- 供应商器件封装：
SMD-8C
- 安装类型：
表面贴装型
- 描述：
IC OFFLINE SWITCH FLYBACK 8SMD
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PI |
23+ |
SOP-8 |
12500 |
全新原装现货,假一赔十 |
询价 | ||
POWER |
20+ |
SOP-7 |
9986 |
询价 | |||
POWER |
23+ |
SMD |
28500 |
PO主营品牌深圳百分百原装现货假一罚十绝对价优 |
询价 | ||
POWER |
22+ |
SMD-8 |
9600 |
原装现货,优势供应,支持实单! |
询价 | ||
POWER |
21+ |
SMD8 |
6850 |
只做原装正品假一赔十!正规渠道订货! |
询价 | ||
POWER INTEGRATED |
2305+ |
原厂封装 |
8900 |
15年芯片行业经验/只供原装正品:0755-83267371邹小姐 |
询价 | ||
POWER |
21+ |
SMD-8 |
20000 |
只做原装,质量保证 |
询价 | ||
POWER |
19+/20+ |
SOP7 |
7784 |
询价 | |||
POWER |
2339+ |
SMD |
32280 |
原装现货 假一罚十!十年信誉只做原装! |
询价 | ||
POWER |
21+ |
SMD |
10000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
询价 |
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