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TG-A6200

Ultra Soft Thermal Pad

Features •Highthermalconductivity •Highcompressibility •Naturaltack Applications: Bestforhighpowerapplications

TGLOBAL

T-Global Technology

TG-A6200F

Fiberglass Mesh Series Thermal Pad

Features •Highthermalconductivity •Fiberglassononeside •Non-deforming •Electricalinsulation Application: Suitableforvoltage-resistantproducts

TGLOBAL

T-Global Technology

TG-A6200LC

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-135-135-0.5

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-135-135-1.0

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-135-135-1.5

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-135-135-2.0

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-135-135-2.5

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-270-270-0.5

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-270-270-1.0

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-270-270-1.5

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-270-270-2.0

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200LC-270-270-2.5

High Performance Thermal Pad

Features •Greatthermalconductivity •Difficulttobedeformed •Easytoassemble •Onesidelowtack Applications Electroniccomponents-ElectricVehicles,5G,AutopilotSystem,Mobile Phone,AIOT,HPC(HighPerformanceComputing),Server,IC,CPU,MOS,LED, MotherBoard,PowerSupply

TGLOBAL

T-Global Technology

TG-A6200-100-100-0.8

包装:散装 类别:风扇,热管理 热 - 垫,片 描述:THERMAL PAD 100X100MM BLUE

TGLOBAL

T-Global Technology

TG-A6200-100-100-1.0

包装:散装 类别:风扇,热管理 热 - 垫,片 描述:SILICONE THERMAL PAD 100X100X1.0

TGLOBAL

T-Global Technology

TG-A6200-100-100-1.5

包装:散装 类别:风扇,热管理 热 - 垫,片 描述:SILICONE THERMAL PAD 100X100X1.5

TGLOBAL

T-Global Technology

6200

IECApplianceInletC14withFuseholder1-pole,wired

SCHURTERSchurter Inc.

硕特硕特集团

6200

IECApplianceInletC14withFuseholder1-pole

SCHURTERSchurter Inc.

硕特硕特集团

6200

3MHalfFacepieceReusableRespirator6200/07025

3MMinnesota Mining and Manufacturing

明尼苏达矿务明尼苏达矿务及制造业公司

6200

4700

ETC1List of Unclassifed Manufacturers

未分类制造商

供应商型号品牌批号封装库存备注价格
Triquint
2018+
SMD
1680
Triquint专营品牌进口原装现货假一赔十
询价
TRIQUINT
638
原装正品
询价
TriQuint
16+
NA
3000
全新进口原装
询价
TRIQUINT
23+
N/A
7560
原厂原装
询价
TI
21+
SMD
50000
全新原装正品现货,支持订货
询价
TI
10+
SMD
5
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
TI
10+
SMD
5
全新原装,支持实单,假一罚十,德创芯微
询价
TI
2023+
SMD
700000
柒号芯城跟原厂的距离只有0.07公分
询价
-
21+
NA
249088856
原厂VIP渠道,亚太地区一级代理商,可提供更多数量!
询价
TriQuint
23+
Chip
184
全新原装优势
询价
更多TG-A6200供应商 更新时间2024-6-6 15:35:00